Details
| Original language | English |
|---|---|
| Title of host publication | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
| Publisher | VDE Verlag GmbH |
| Pages | 763-766 |
| Number of pages | 4 |
| ISBN (electronic) | 9783800762040 |
| Publication status | Published - 2023 |
| Event | Technology Congress 2023: Microelectronics, Microsystems Technology and their Applications - Sustainability and Technology Sovereignty - Dresden, Germany Duration: 23 Oct 2023 → 25 Oct 2023 |
Abstract
The feasibility to achieve and maintain ultra-high vacuum (UHV) on chip-scale packages represents a major step towards the miniaturization of affordable and pocket-sized quantum systems. Various components, which are essential for these systems, are under research at the Institute of Micro Production Technology, including a hermetic micro-fabricated vacuum package. To achieve this, a UHV Bonder was developed and set up in its first initial iteration, capable of capsulating under UHV conditions and thereby providing a promising outlook for an integration of said components inside the package. A chamber base pressure of 8*10-9 mbar was reached without a bakeout before bonding and Au-Au samples have been successfully bonded at low temperatures (200°C) with an applied pressure of 600 N. Vacuum characteristics were analyzed using a residual gas analyzer (RGA), while the bonded samples were characterized through shear tests and examined with SEM.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Materials Science(all)
- Surfaces, Coatings and Films
- Physics and Astronomy(all)
- Condensed Matter Physics
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
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MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. p. 763-766.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Setup of an ultra-high vacuum bonder for the encapsulation of quantum systems
AU - Droese, Niklas
AU - Petring, Julian
AU - Hadeler, Steffen
AU - Kassner, Alexander
AU - Dencker, Folke
AU - Wurz, Marc C.
N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023
Y1 - 2023
N2 - The feasibility to achieve and maintain ultra-high vacuum (UHV) on chip-scale packages represents a major step towards the miniaturization of affordable and pocket-sized quantum systems. Various components, which are essential for these systems, are under research at the Institute of Micro Production Technology, including a hermetic micro-fabricated vacuum package. To achieve this, a UHV Bonder was developed and set up in its first initial iteration, capable of capsulating under UHV conditions and thereby providing a promising outlook for an integration of said components inside the package. A chamber base pressure of 8*10-9 mbar was reached without a bakeout before bonding and Au-Au samples have been successfully bonded at low temperatures (200°C) with an applied pressure of 600 N. Vacuum characteristics were analyzed using a residual gas analyzer (RGA), while the bonded samples were characterized through shear tests and examined with SEM.
AB - The feasibility to achieve and maintain ultra-high vacuum (UHV) on chip-scale packages represents a major step towards the miniaturization of affordable and pocket-sized quantum systems. Various components, which are essential for these systems, are under research at the Institute of Micro Production Technology, including a hermetic micro-fabricated vacuum package. To achieve this, a UHV Bonder was developed and set up in its first initial iteration, capable of capsulating under UHV conditions and thereby providing a promising outlook for an integration of said components inside the package. A chamber base pressure of 8*10-9 mbar was reached without a bakeout before bonding and Au-Au samples have been successfully bonded at low temperatures (200°C) with an applied pressure of 600 N. Vacuum characteristics were analyzed using a residual gas analyzer (RGA), while the bonded samples were characterized through shear tests and examined with SEM.
UR - http://www.scopus.com/inward/record.url?scp=85196911569&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196911569
SP - 763
EP - 766
BT - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
PB - VDE Verlag GmbH
T2 - Technology Congress 2023
Y2 - 23 October 2023 through 25 October 2023
ER -