Details
| Original language | English |
|---|---|
| Pages (from-to) | 1975-1981 |
| Number of pages | 7 |
| Journal | Microsystem Technologies |
| Volume | 14 |
| Issue number | 12 |
| Publication status | Published - 31 Jul 2008 |
| Externally published | Yes |
Abstract
This article presents (the most) recent results of the subprojects B4 and B8 of the Collaborative Research Center 516-Design and Manufacturing of Active Micro Systems-which are concerned with the assembly of active micro systems. While subproject B4 investigates sensor guided assembly processes, subproject B8 develops suitable assembly techniques on the basis of non-viscous adhesive systems (hot melts). Process development focuses on the suitability for automation, process times and the applicability of batch processes. The article discusses certain hot melt application techniques that are suitable for batch production, a sensor-guided assembly system as well as different approaches for heat conduction in an automated assembly process for hot melt coated micro components.
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Condensed Matter Physics
- Computer Science(all)
- Hardware and Architecture
- Engineering(all)
- Electrical and Electronic Engineering
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In: Microsystem Technologies, Vol. 14, No. 12, 31.07.2008, p. 1975-1981.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Sensor-guided micro assembly of active micro systems by using a hot melt based joining technology
AU - Rathmann, Sven
AU - Schöttler, Kerstin
AU - Berndt, Michael
AU - Hemken, Gregor
AU - Raatz, Annika
AU - Tutsch, Rainer
AU - Böhm, Stefan
N1 - Funding information: The authors gratefully acknowledge the funding of the reported work by the German Research Center (Collaborative Research Center 516 “Design and Manufacturing of Active Micro Systems”).
PY - 2008/7/31
Y1 - 2008/7/31
N2 - This article presents (the most) recent results of the subprojects B4 and B8 of the Collaborative Research Center 516-Design and Manufacturing of Active Micro Systems-which are concerned with the assembly of active micro systems. While subproject B4 investigates sensor guided assembly processes, subproject B8 develops suitable assembly techniques on the basis of non-viscous adhesive systems (hot melts). Process development focuses on the suitability for automation, process times and the applicability of batch processes. The article discusses certain hot melt application techniques that are suitable for batch production, a sensor-guided assembly system as well as different approaches for heat conduction in an automated assembly process for hot melt coated micro components.
AB - This article presents (the most) recent results of the subprojects B4 and B8 of the Collaborative Research Center 516-Design and Manufacturing of Active Micro Systems-which are concerned with the assembly of active micro systems. While subproject B4 investigates sensor guided assembly processes, subproject B8 develops suitable assembly techniques on the basis of non-viscous adhesive systems (hot melts). Process development focuses on the suitability for automation, process times and the applicability of batch processes. The article discusses certain hot melt application techniques that are suitable for batch production, a sensor-guided assembly system as well as different approaches for heat conduction in an automated assembly process for hot melt coated micro components.
UR - http://www.scopus.com/inward/record.url?scp=51849138912&partnerID=8YFLogxK
U2 - 10.1007/s00542-008-0681-5
DO - 10.1007/s00542-008-0681-5
M3 - Article
AN - SCOPUS:51849138912
VL - 14
SP - 1975
EP - 1981
JO - Microsystem Technologies
JF - Microsystem Technologies
SN - 0946-7076
IS - 12
ER -