Reliability of discrete power semiconductor packages and systems - D2Pak and CanPAK in comparison

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Kay Hofmann
  • Christian Herold
  • Menia Beier
  • Josef Lutz
  • Jens Friebe

External Research Organisations

  • Chemnitz University of Technology (CUT)
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Details

Original languageEnglish
Title of host publication2013 15th European Conference on Power Electronics and Applications, EPE 2013
Publication statusPublished - 2013
Event2013 15th European Conference on Power Electronics and Applications, EPE 2013 - Lille, France
Duration: 2 Sept 20136 Sept 2013

Publication series

Name2013 15th European Conference on Power Electronics and Applications, EPE 2013

Abstract

The reliability of discrete power semiconductor packages is getting more and more important in regard to the increasing number of power applications in the low power range. Therefore it is necessary to get more information and details on reliability of discrete packages and systems by performing reliability tests as well as simulations. In this paper the chosen approach and first results of simulations and tests are described on D2Pak and CanPAK systems as often used discrete power semiconductor packages.

Keywords

    Discrete power device, Packaging, Power cycling, Reliability

ASJC Scopus subject areas

Cite this

Reliability of discrete power semiconductor packages and systems - D2Pak and CanPAK in comparison. / Hofmann, Kay; Herold, Christian; Beier, Menia et al.
2013 15th European Conference on Power Electronics and Applications, EPE 2013. 2013. 6634611 (2013 15th European Conference on Power Electronics and Applications, EPE 2013).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Hofmann, K, Herold, C, Beier, M, Lutz, J & Friebe, J 2013, Reliability of discrete power semiconductor packages and systems - D2Pak and CanPAK in comparison. in 2013 15th European Conference on Power Electronics and Applications, EPE 2013., 6634611, 2013 15th European Conference on Power Electronics and Applications, EPE 2013, 2013 15th European Conference on Power Electronics and Applications, EPE 2013, Lille, France, 2 Sept 2013. https://doi.org/10.1109/EPE.2013.6634611
Hofmann, K., Herold, C., Beier, M., Lutz, J., & Friebe, J. (2013). Reliability of discrete power semiconductor packages and systems - D2Pak and CanPAK in comparison. In 2013 15th European Conference on Power Electronics and Applications, EPE 2013 Article 6634611 (2013 15th European Conference on Power Electronics and Applications, EPE 2013). https://doi.org/10.1109/EPE.2013.6634611
Hofmann K, Herold C, Beier M, Lutz J, Friebe J. Reliability of discrete power semiconductor packages and systems - D2Pak and CanPAK in comparison. In 2013 15th European Conference on Power Electronics and Applications, EPE 2013. 2013. 6634611. (2013 15th European Conference on Power Electronics and Applications, EPE 2013). doi: 10.1109/EPE.2013.6634611
Hofmann, Kay ; Herold, Christian ; Beier, Menia et al. / Reliability of discrete power semiconductor packages and systems - D2Pak and CanPAK in comparison. 2013 15th European Conference on Power Electronics and Applications, EPE 2013. 2013. (2013 15th European Conference on Power Electronics and Applications, EPE 2013).
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