Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 14-21 |
| Number of pages | 8 |
| ISBN (electronic) | 9780738145235 |
| Publication status | Published - 2021 |
| Event | 71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, United States Duration: 1 Jun 2021 → 4 Jul 2021 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Volume | 2021-June |
| ISSN (Print) | 0569-5503 |
Abstract
In this paper we investigate the long-term stability and reliability of a 3D-Opto-MID package for multimode waveguide bus coupling. Preliminary works proved an interruption-free coupling approach with asymmetric coupling rates depending on the coupling direction for optical bus systems. This is possible thanks to a coupling at the side-faces of the waveguide cores where one coupling partner has a defined bending to achieve the asymmetric coupling. Crucial for this defined bending are three-dimensional assemblies. For this, we developed a mixed-material package based on ceramic thick-film substrates combined with stereo-lithographic printed polymers. Because of the different material parameters, we analyzed the package behavior in a high temperature storage, a temperature humidity and a temperature cycle test. The results of the reliability tests enable specific further development of the package and thus make an important contribution to the intended series production of the 3D-Opto-MID technology.
Keywords
- 3D mechatronic integrated device, Interruption-free waveguide coupling, Long-term stability, Mixed-material package, Reliability, Stereo-lithographic printing
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 14-21 (Proceedings - Electronic Components and Technology Conference; Vol. 2021-June).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Reliability of 3D-Opto-MID Packages for Asymmetric Optical Bus Couplers
AU - Lorenz, Lukas
AU - Hanesch, Florian
AU - Nieweglowski, Krzysztof
AU - Hamjah, Mohd Khairulamzari
AU - Franke, Jörg
AU - Hoffmann, Gerd Albert
AU - Overmeyer, Ludger
AU - Bock, Karlheinz
N1 - Funding Information: The authors would like to thank Ilias Sotiriou for the preparation of the waveguides. The DFB lasers for the 3D-Opto-MID were purchased in an experimental state from the Fraunhofer Heinrich-Hertz-Institut Berlin. Funding Information: The German Research Foundation (DFG) in the Research Group OPTAVER supported this work (BO 3438/4-1; AOBJ: 648318).
PY - 2021
Y1 - 2021
N2 - In this paper we investigate the long-term stability and reliability of a 3D-Opto-MID package for multimode waveguide bus coupling. Preliminary works proved an interruption-free coupling approach with asymmetric coupling rates depending on the coupling direction for optical bus systems. This is possible thanks to a coupling at the side-faces of the waveguide cores where one coupling partner has a defined bending to achieve the asymmetric coupling. Crucial for this defined bending are three-dimensional assemblies. For this, we developed a mixed-material package based on ceramic thick-film substrates combined with stereo-lithographic printed polymers. Because of the different material parameters, we analyzed the package behavior in a high temperature storage, a temperature humidity and a temperature cycle test. The results of the reliability tests enable specific further development of the package and thus make an important contribution to the intended series production of the 3D-Opto-MID technology.
AB - In this paper we investigate the long-term stability and reliability of a 3D-Opto-MID package for multimode waveguide bus coupling. Preliminary works proved an interruption-free coupling approach with asymmetric coupling rates depending on the coupling direction for optical bus systems. This is possible thanks to a coupling at the side-faces of the waveguide cores where one coupling partner has a defined bending to achieve the asymmetric coupling. Crucial for this defined bending are three-dimensional assemblies. For this, we developed a mixed-material package based on ceramic thick-film substrates combined with stereo-lithographic printed polymers. Because of the different material parameters, we analyzed the package behavior in a high temperature storage, a temperature humidity and a temperature cycle test. The results of the reliability tests enable specific further development of the package and thus make an important contribution to the intended series production of the 3D-Opto-MID technology.
KW - 3D mechatronic integrated device
KW - Interruption-free waveguide coupling
KW - Long-term stability
KW - Mixed-material package
KW - Reliability
KW - Stereo-lithographic printing
UR - http://www.scopus.com/inward/record.url?scp=85124668330&partnerID=8YFLogxK
U2 - 10.1109/ECTC32696.2021.00014
DO - 10.1109/ECTC32696.2021.00014
M3 - Conference contribution
AN - SCOPUS:85124668330
T3 - Proceedings - Electronic Components and Technology Conference
SP - 14
EP - 21
BT - Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 71st IEEE Electronic Components and Technology Conference, ECTC 2021
Y2 - 1 June 2021 through 4 July 2021
ER -