Reduction of interfacial carbon and boron contamination as sources for degradation of epitaxial SiGe layers grown by MBE

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • H. P. Zeindl
  • G. Lippert
  • J. Drews
  • R. Kurps
  • H. J. Osten

External Research Organisations

  • Leibniz Institute for High Performance Microelectronics (IHP)
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Details

Original languageEnglish
Title of host publicationGettering and Defect Engineering in Semiconductor Technology, GADEST 93
EditorsH.G. Grimmeiss, M. Kittler, H. Richter
Pages117-122
Number of pages6
Publication statusPublished - Dec 1993
Externally publishedYes
Event5th International Autumn Meeting on Gettering and Defect Engineering in Semiconductor Technology, GADEST 1993 - Chossewitz, Frankfurt (Oder), Germany
Duration: 9 Oct 199314 Oct 1993

Publication series

NameSolid State Phenomena
Volume32-33
ISSN (Print)1012-0394
ISSN (electronic)1662-9779

Abstract

In order to grow high quality epitaxial MBE layers, substrates with atomically clean surfaces are required. In this paper we investigated the effectiveness of different wet chemical ex-situ cleaning procedures and an UV/ozone in-situ method on the reduction of interfacial boron and carbon contamination. The carbon desorption was monitored in-situ by XPS. The UV/ozone cleaning reduces the carbon concentration below the detection limit of XPS. Cleaned wafers were coated with silicon and the capped interface was characterized ex-situ by SIMS. By growth interruption the recontamination of an epitaxial layer in ultra high vacuum was investigated. No additional carbon could be detected by SIMS after a growth interruption of 2 hours.

ASJC Scopus subject areas

Cite this

Reduction of interfacial carbon and boron contamination as sources for degradation of epitaxial SiGe layers grown by MBE. / Zeindl, H. P.; Lippert, G.; Drews, J. et al.
Gettering and Defect Engineering in Semiconductor Technology, GADEST 93. ed. / H.G. Grimmeiss; M. Kittler; H. Richter. 1993. p. 117-122 (Solid State Phenomena; Vol. 32-33).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Zeindl, HP, Lippert, G, Drews, J, Kurps, R & Osten, HJ 1993, Reduction of interfacial carbon and boron contamination as sources for degradation of epitaxial SiGe layers grown by MBE. in HG Grimmeiss, M Kittler & H Richter (eds), Gettering and Defect Engineering in Semiconductor Technology, GADEST 93. Solid State Phenomena, vol. 32-33, pp. 117-122, 5th International Autumn Meeting on Gettering and Defect Engineering in Semiconductor Technology, GADEST 1993, Chossewitz, Frankfurt (Oder), Germany, 9 Oct 1993. https://doi.org/10.4028/www.scientific.net/SSP.32-33.117
Zeindl, H. P., Lippert, G., Drews, J., Kurps, R., & Osten, H. J. (1993). Reduction of interfacial carbon and boron contamination as sources for degradation of epitaxial SiGe layers grown by MBE. In H. G. Grimmeiss, M. Kittler, & H. Richter (Eds.), Gettering and Defect Engineering in Semiconductor Technology, GADEST 93 (pp. 117-122). (Solid State Phenomena; Vol. 32-33). https://doi.org/10.4028/www.scientific.net/SSP.32-33.117
Zeindl HP, Lippert G, Drews J, Kurps R, Osten HJ. Reduction of interfacial carbon and boron contamination as sources for degradation of epitaxial SiGe layers grown by MBE. In Grimmeiss HG, Kittler M, Richter H, editors, Gettering and Defect Engineering in Semiconductor Technology, GADEST 93. 1993. p. 117-122. (Solid State Phenomena). doi: 10.4028/www.scientific.net/SSP.32-33.117
Zeindl, H. P. ; Lippert, G. ; Drews, J. et al. / Reduction of interfacial carbon and boron contamination as sources for degradation of epitaxial SiGe layers grown by MBE. Gettering and Defect Engineering in Semiconductor Technology, GADEST 93. editor / H.G. Grimmeiss ; M. Kittler ; H. Richter. 1993. pp. 117-122 (Solid State Phenomena).
Download
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abstract = "In order to grow high quality epitaxial MBE layers, substrates with atomically clean surfaces are required. In this paper we investigated the effectiveness of different wet chemical ex-situ cleaning procedures and an UV/ozone in-situ method on the reduction of interfacial boron and carbon contamination. The carbon desorption was monitored in-situ by XPS. The UV/ozone cleaning reduces the carbon concentration below the detection limit of XPS. Cleaned wafers were coated with silicon and the capped interface was characterized ex-situ by SIMS. By growth interruption the recontamination of an epitaxial layer in ultra high vacuum was investigated. No additional carbon could be detected by SIMS after a growth interruption of 2 hours.",
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