Reduction of droplet emission in random arc technology

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Original languageEnglish
Pages (from-to)65-74
Number of pages10
JournalSurface and Coatings Technology
Volume46
Issue number1
Publication statusPublished - 30 May 1991
Externally publishedYes

Abstract

The influence of a static magnetic field (0-10 mT at the emission plane of the cathode) in random arc reactive physical vapour deposition (PVD) (TiN, CrN) and non-reactive PVD (titanium, chromium, copper, nickel) has been investigated using various cathode designs. The dominant effect of an increased magnetic field was a more confined arc trace. In non-reactive processes, detrimental selective cathode erosion was observed. In reactive processes, improved nitriding resulted. A distinct reduction in droplet emission was achieved only with a high melting nitride layer (TiN). Cathode design may assist in droplet reduction by further confinement of the arc trace. In all reactive processes, changes in layer microstructure were detected indicating a decrease in ion energy with increasing magnetic field. Surface roughness values comparable with those obtained in steered arc PVD can be achieved, using strong static magnetic fields combined with modified cathode design, if the process is run at a stabilized steady state nitrogen pressure of about 1 Pa from its very start.

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Reduction of droplet emission in random arc technology. / Steffens, H. D.; Mack, M.; Moehwald, K. et al.
In: Surface and Coatings Technology, Vol. 46, No. 1, 30.05.1991, p. 65-74.

Research output: Contribution to journalArticleResearchpeer review

Steffens HD, Mack M, Moehwald K, Reichel K. Reduction of droplet emission in random arc technology. Surface and Coatings Technology. 1991 May 30;46(1):65-74. doi: 10.1016/0257-8972(91)90150-U
Steffens, H. D. ; Mack, M. ; Moehwald, K. et al. / Reduction of droplet emission in random arc technology. In: Surface and Coatings Technology. 1991 ; Vol. 46, No. 1. pp. 65-74.
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AU - Steffens, H. D.

AU - Mack, M.

AU - Moehwald, K.

AU - Reichel, K.

PY - 1991/5/30

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