Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • M. Brinkmann
  • R. Delsol
  • T. Daschinger
  • R. Brendel
  • H. Schulte-Huxel

Research Organisations

External Research Organisations

  • Institute for Solar Energy Research (ISFH)
View graph of relations

Details

Original languageEnglish
Title of host publication2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages253-255
Number of pages3
ISBN (electronic)9781665464260
ISBN (print)978-1-6654-7582-2
Publication statusPublished - 9 Jun 2024
Event52nd IEEE Photovoltaic Specialist Conference, PVSC 2024 - Seattle, United States
Duration: 9 Jun 202414 Jun 2024

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371
ISSN (electronic)2995-1755

Abstract

Reducing the silver consumption of photovoltaics (PV) is a major aspect in recent solar cell research. For PERC+ solar cells silver is used for the front contact and as solder pads on the rear side. An ultrasonic (US) soldering process is used to wet Al structures on the rear side of PERC+ with lead-free solder and manufacture silver-free solder pads for the standard tabbing process. Peel tests are carried out showing an adhesion of above 2 N/mm of the cell interconnects. Contact resistance measurements are performed showing a comparable contribution to the series resistance as silver solder pads. Minimodules are fabricated reaching the same efficiency as a reference module with standard silver pad rear side connection and a degradation of less than 3.6% after 200 humidity-freeze cycles.

ASJC Scopus subject areas

Cite this

Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. / Brinkmann, M.; Delsol, R.; Daschinger, T. et al.
2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024. Institute of Electrical and Electronics Engineers Inc., 2024. p. 253-255 (Conference Record of the IEEE Photovoltaic Specialists Conference).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Brinkmann, M, Delsol, R, Daschinger, T, Brendel, R & Schulte-Huxel, H 2024, Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. in 2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024. Conference Record of the IEEE Photovoltaic Specialists Conference, Institute of Electrical and Electronics Engineers Inc., pp. 253-255, 52nd IEEE Photovoltaic Specialist Conference, PVSC 2024, Seattle, United States, 9 Jun 2024. https://doi.org/10.1109/PVSC57443.2024.10748728
Brinkmann, M., Delsol, R., Daschinger, T., Brendel, R., & Schulte-Huxel, H. (2024). Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. In 2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024 (pp. 253-255). (Conference Record of the IEEE Photovoltaic Specialists Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC57443.2024.10748728
Brinkmann M, Delsol R, Daschinger T, Brendel R, Schulte-Huxel H. Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. In 2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024. Institute of Electrical and Electronics Engineers Inc. 2024. p. 253-255. (Conference Record of the IEEE Photovoltaic Specialists Conference). doi: 10.1109/PVSC57443.2024.10748728
Brinkmann, M. ; Delsol, R. ; Daschinger, T. et al. / Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. 2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024. Institute of Electrical and Electronics Engineers Inc., 2024. pp. 253-255 (Conference Record of the IEEE Photovoltaic Specialists Conference).
Download
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abstract = "Reducing the silver consumption of photovoltaics (PV) is a major aspect in recent solar cell research. For PERC+ solar cells silver is used for the front contact and as solder pads on the rear side. An ultrasonic (US) soldering process is used to wet Al structures on the rear side of PERC+ with lead-free solder and manufacture silver-free solder pads for the standard tabbing process. Peel tests are carried out showing an adhesion of above 2 N/mm of the cell interconnects. Contact resistance measurements are performed showing a comparable contribution to the series resistance as silver solder pads. Minimodules are fabricated reaching the same efficiency as a reference module with standard silver pad rear side connection and a degradation of less than 3.6% after 200 humidity-freeze cycles.",
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