Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters

Research output: Contribution to journal › Article › Research › peer review

Authors

  • Yangyang Long
  • Friedrich Schneider
  • Chun Li
  • Jörg Hermsdorf
  • Jens Twiefel
  • Jörg Wallaschek

Research Organisations

External Research Organisations

  • Laser Zentrum Hannover e.V. (LZH)
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Details

Original languageEnglish
Pages (from-to)449-463
Number of pages15
JournalInternational Journal of Precision Engineering and Manufacturing - Green Technology
Volume6
Issue number3
Early online date4 Mar 2019
Publication statusPublished - 1 Jul 2019

Keywords

    Energy flows, Interface, Process parameters, Relative motion, Ultrasonic wire bonding

ASJC Scopus subject areas

Sustainable Development Goals

Cite this

Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters. / Long, Yangyang; Schneider, Friedrich; Li, Chun et al.
In: International Journal of Precision Engineering and Manufacturing - Green Technology, Vol. 6, No. 3, 01.07.2019, p. 449-463.

Research output: Contribution to journal › Article › Research › peer review

Long Y, Schneider F, Li C, Hermsdorf J, Twiefel J, Wallaschek J. Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters. International Journal of Precision Engineering and Manufacturing - Green Technology. 2019 Jul 1;6(3):449-463. Epub 2019 Mar 4. doi: 10.1007/s40684-019-00061-0
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note = "Funding information: We gratefully acknowledge the support from the Ministry of Science and Culture of Lower Saxony, Germany within the Multifunktionale Aktive und Reaktive Interfaces und Oberfl{\"a}chen (MARIO) program and Deutsche Forschungsgemeinschaft (DFG) program (TW75/8-1|WA564/40-1). Great thanks to Hesse Mechantronics GmbH for providing the bonding head HBK05 and Mr. Heiner Ramsbott from Vision Research Europe for providing the lens.",
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AU - Twiefel, Jens

AU - Wallaschek, Jörg

N1 - Funding information: We gratefully acknowledge the support from the Ministry of Science and Culture of Lower Saxony, Germany within the Multifunktionale Aktive und Reaktive Interfaces und Oberflächen (MARIO) program and Deutsche Forschungsgemeinschaft (DFG) program (TW75/8-1|WA564/40-1). Great thanks to Hesse Mechantronics GmbH for providing the bonding head HBK05 and Mr. Heiner Ramsbott from Vision Research Europe for providing the lens.

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