Details
| Original language | English |
|---|---|
| Pages (from-to) | 332-341 |
| Number of pages | 10 |
| Journal | Metallography, Microstructure, and Analysis |
| Volume | 5 |
| Issue number | 4 |
| Early online date | 10 May 2016 |
| Publication status | Published - Aug 2016 |
Abstract
The choice of embedding-media for metallographic specimen preparation, where subsequent scanning electron microscopy will be performed, is highly important since the quality of the analytical results in the specimen’s near-surface region is limited by the properties of the embedding-material. Due to their high electrical conductivity and only slight tendency to form gaps between near the sample surface, warm curing embedding-media are usually best suited. Hot embedding-presses use relatively high pressures at elevated temperatures that can be detrimental for sensitive materials or coatings. Cold embedding with conventional embedding-media, which does not require high pressure mounting, requires compromising for a material with a lower electric conductivity, a higher amount of pores in the material, and inferior interfacial connectivity to the specimen. For this reason, the development of alternative electrically conductive and cold hardening embedding-media is of great interest for metallographic sample preparation of electron microscopy specimens. In the present study, various embedding-media were evaluated with respect to their suitability for scanning electron microscopy and a novel conductive mounting compound has been identified and qualified.
Keywords
- Cold embedding, Metallographic preparation, Scanning electron microscopy
ASJC Scopus subject areas
- Materials Science(all)
- Metals and Alloys
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In: Metallography, Microstructure, and Analysis, Vol. 5, No. 4, 08.2016, p. 332-341.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Qualifying Electrically Conductive Cold Embedding-Media for Scanning Electron Microscopy
AU - Besserer, Hans Bernward
AU - Boiarkin, Viacheslav
AU - Rodman, Dmytro
AU - Nürnberger, Florian
N1 - Funding information: The authors thank the German Research Foundation for the financial support of the work carried out within the scope of the transregional research centre SFB/TR 73 in sub-project C6 “Fatigue behavior” and the additional sub-project C6 “Optimization of the fatigue behavior.” Special thanks go to Ms. Ute Teuber and Ms. Kristin Kreuzarek for their support with the metallographic analysis.
PY - 2016/8
Y1 - 2016/8
N2 - The choice of embedding-media for metallographic specimen preparation, where subsequent scanning electron microscopy will be performed, is highly important since the quality of the analytical results in the specimen’s near-surface region is limited by the properties of the embedding-material. Due to their high electrical conductivity and only slight tendency to form gaps between near the sample surface, warm curing embedding-media are usually best suited. Hot embedding-presses use relatively high pressures at elevated temperatures that can be detrimental for sensitive materials or coatings. Cold embedding with conventional embedding-media, which does not require high pressure mounting, requires compromising for a material with a lower electric conductivity, a higher amount of pores in the material, and inferior interfacial connectivity to the specimen. For this reason, the development of alternative electrically conductive and cold hardening embedding-media is of great interest for metallographic sample preparation of electron microscopy specimens. In the present study, various embedding-media were evaluated with respect to their suitability for scanning electron microscopy and a novel conductive mounting compound has been identified and qualified.
AB - The choice of embedding-media for metallographic specimen preparation, where subsequent scanning electron microscopy will be performed, is highly important since the quality of the analytical results in the specimen’s near-surface region is limited by the properties of the embedding-material. Due to their high electrical conductivity and only slight tendency to form gaps between near the sample surface, warm curing embedding-media are usually best suited. Hot embedding-presses use relatively high pressures at elevated temperatures that can be detrimental for sensitive materials or coatings. Cold embedding with conventional embedding-media, which does not require high pressure mounting, requires compromising for a material with a lower electric conductivity, a higher amount of pores in the material, and inferior interfacial connectivity to the specimen. For this reason, the development of alternative electrically conductive and cold hardening embedding-media is of great interest for metallographic sample preparation of electron microscopy specimens. In the present study, various embedding-media were evaluated with respect to their suitability for scanning electron microscopy and a novel conductive mounting compound has been identified and qualified.
KW - Cold embedding
KW - Metallographic preparation
KW - Scanning electron microscopy
UR - http://www.scopus.com/inward/record.url?scp=84980041554&partnerID=8YFLogxK
U2 - 10.1007/s13632-016-0286-9
DO - 10.1007/s13632-016-0286-9
M3 - Article
AN - SCOPUS:84980041554
VL - 5
SP - 332
EP - 341
JO - Metallography, Microstructure, and Analysis
JF - Metallography, Microstructure, and Analysis
SN - 2192-9262
IS - 4
ER -