Details
| Original language | English |
|---|---|
| Pages (from-to) | 396-401 |
| Number of pages | 6 |
| Journal | Solar Energy Materials and Solar Cells |
| Volume | 120 |
| Issue number | A |
| Early online date | 23 Jul 2013 |
| Publication status | Published - 2014 |
Abstract
Module-level-processing applies cell processing and/or cell interconnection processes while the silicon wafers are attached to a sub- or superstrate, such as the module glass. This thin-film/wafer-hybrid- silicon (HySi) approach offers unique possibilities when using ultra-thin silicon wafers that can hardly be processed free-standing. Liquid adhesives are one option for attaching the wafers to the module glass. Here, we analyze the compatibility of a selection of adhesives with module-level processing. The adhesives have to be stable during wet chemical steps and during thermal treatments. A further requirement is that outgassing from the adhesives should be sufficiently low to allow efficient surface passivation by e.g. plasma enhanced chemical vapor deposition. The adhesives have to withstand UV-irradiation and thermal exposure in order to fulfill warranty requirements. In this work we develop and apply tests for the screening of adhesives. We find that certain liquid addition-curing 2-part silicones pass all the tests and are thus attractive candidates for module-level-processing.
Keywords
- Module-level-processing, PECVD process, Silicones, Substrate, Thin Si layers, Wafer-hybrid-Si technology
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Energy(all)
- Renewable Energy, Sustainability and the Environment
- Materials Science(all)
- Surfaces, Coatings and Films
Sustainable Development Goals
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In: Solar Energy Materials and Solar Cells, Vol. 120, No. A, 2014, p. 396-401.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Qualification of encapsulation materials for module-level-processing
AU - Steckenreiter, Verena
AU - Horbelt, Renate
AU - Wright, Daniel Nilsen
AU - Nese, Martin
AU - Brendel, Rolf
PY - 2014
Y1 - 2014
N2 - Module-level-processing applies cell processing and/or cell interconnection processes while the silicon wafers are attached to a sub- or superstrate, such as the module glass. This thin-film/wafer-hybrid- silicon (HySi) approach offers unique possibilities when using ultra-thin silicon wafers that can hardly be processed free-standing. Liquid adhesives are one option for attaching the wafers to the module glass. Here, we analyze the compatibility of a selection of adhesives with module-level processing. The adhesives have to be stable during wet chemical steps and during thermal treatments. A further requirement is that outgassing from the adhesives should be sufficiently low to allow efficient surface passivation by e.g. plasma enhanced chemical vapor deposition. The adhesives have to withstand UV-irradiation and thermal exposure in order to fulfill warranty requirements. In this work we develop and apply tests for the screening of adhesives. We find that certain liquid addition-curing 2-part silicones pass all the tests and are thus attractive candidates for module-level-processing.
AB - Module-level-processing applies cell processing and/or cell interconnection processes while the silicon wafers are attached to a sub- or superstrate, such as the module glass. This thin-film/wafer-hybrid- silicon (HySi) approach offers unique possibilities when using ultra-thin silicon wafers that can hardly be processed free-standing. Liquid adhesives are one option for attaching the wafers to the module glass. Here, we analyze the compatibility of a selection of adhesives with module-level processing. The adhesives have to be stable during wet chemical steps and during thermal treatments. A further requirement is that outgassing from the adhesives should be sufficiently low to allow efficient surface passivation by e.g. plasma enhanced chemical vapor deposition. The adhesives have to withstand UV-irradiation and thermal exposure in order to fulfill warranty requirements. In this work we develop and apply tests for the screening of adhesives. We find that certain liquid addition-curing 2-part silicones pass all the tests and are thus attractive candidates for module-level-processing.
KW - Module-level-processing
KW - PECVD process
KW - Silicones
KW - Substrate
KW - Thin Si layers
KW - Wafer-hybrid-Si technology
UR - http://www.scopus.com/inward/record.url?scp=84888322267&partnerID=8YFLogxK
U2 - 10.1016/j.solmat.2013.06.012
DO - 10.1016/j.solmat.2013.06.012
M3 - Article
AN - SCOPUS:84888322267
VL - 120
SP - 396
EP - 401
JO - Solar Energy Materials and Solar Cells
JF - Solar Energy Materials and Solar Cells
SN - 0927-0248
IS - A
ER -