Processor Architecture Tradeoffs for On-Site Electronics in Harsh Environment

Research output: Contribution to conferencePaperResearchpeer review

Authors

  • Stephan Nolting
  • Sven Gesper
  • Achim Schmider
  • Moritz Weißbrich
  • Tobias Stuckenberg
  • Guillermo Payá Vayá
  • Holger Christoph Blume

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Details

Original languageEnglish
Publication statusPublished - 2018
EventCadence User Conference 2018 - München, Germany
Duration: 7 May 20189 May 2018

Conference

ConferenceCadence User Conference 2018
Abbreviated titleCDN LIVE
Country/TerritoryGermany
CityMünchen
Period7 May 20189 May 2018

Abstract

Microcontroller units placed in harsh environments are manufactured using large semiconductor technology nodes in order to provide reliable operation even at high temperatures or increased radiation exposition. As a drawback, these large technology nodes provide rather high gate propagation delays drastically reducing the system performance. Additionally, when reducing area costs and power consumption, the actual processor architecture becomes a major design point. A processor architecture is defined by several parameters like data path width, type of instruction execution, or the actual underlying architectural design paradigm. This work presents a design space exploration of four different architecture paradigms implemented for a 0.35μm high temperature SOI CMOS technology.

Cite this

Processor Architecture Tradeoffs for On-Site Electronics in Harsh Environment. / Nolting, Stephan; Gesper, Sven; Schmider, Achim et al.
2018. Paper presented at Cadence User Conference 2018, München, Germany.

Research output: Contribution to conferencePaperResearchpeer review

Nolting, S, Gesper, S, Schmider, A, Weißbrich, M, Stuckenberg, T, Payá Vayá, G & Blume, HC 2018, 'Processor Architecture Tradeoffs for On-Site Electronics in Harsh Environment', Paper presented at Cadence User Conference 2018, München, Germany, 7 May 2018 - 9 May 2018. <https://www.cadence.com/content/dam/cadence-www/global/en_US/documents/company/Events/CDNLive/Secured/Proceedings/EU/2018/AC03.pdf>
Nolting, S., Gesper, S., Schmider, A., Weißbrich, M., Stuckenberg, T., Payá Vayá, G., & Blume, H. C. (2018). Processor Architecture Tradeoffs for On-Site Electronics in Harsh Environment. Paper presented at Cadence User Conference 2018, München, Germany. https://www.cadence.com/content/dam/cadence-www/global/en_US/documents/company/Events/CDNLive/Secured/Proceedings/EU/2018/AC03.pdf
Nolting S, Gesper S, Schmider A, Weißbrich M, Stuckenberg T, Payá Vayá G et al.. Processor Architecture Tradeoffs for On-Site Electronics in Harsh Environment. 2018. Paper presented at Cadence User Conference 2018, München, Germany.
Nolting, Stephan ; Gesper, Sven ; Schmider, Achim et al. / Processor Architecture Tradeoffs for On-Site Electronics in Harsh Environment. Paper presented at Cadence User Conference 2018, München, Germany.
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@conference{39fca21878d94b77a3311bebe1d9ee4f,
title = "Processor Architecture Tradeoffs for On-Site Electronics in Harsh Environment",
abstract = "Microcontroller units placed in harsh environments are manufactured using large semiconductor technology nodes in order to provide reliable operation even at high temperatures or increased radiation exposition. As a drawback, these large technology nodes provide rather high gate propagation delays drastically reducing the system performance. Additionally, when reducing area costs and power consumption, the actual processor architecture becomes a major design point. A processor architecture is defined by several parameters like data path width, type of instruction execution, or the actual underlying architectural design paradigm. This work presents a design space exploration of four different architecture paradigms implemented for a 0.35μm high temperature SOI CMOS technology. ",
author = "Stephan Nolting and Sven Gesper and Achim Schmider and Moritz Wei{\ss}brich and Tobias Stuckenberg and {Pay{\'a} Vay{\'a}}, Guillermo and Blume, {Holger Christoph}",
year = "2018",
language = "English",
note = "Cadence User Conference 2018 ; Conference date: 07-05-2018 Through 09-05-2018",

}

Download

TY - CONF

T1 - Processor Architecture Tradeoffs for On-Site Electronics in Harsh Environment

AU - Nolting, Stephan

AU - Gesper, Sven

AU - Schmider, Achim

AU - Weißbrich, Moritz

AU - Stuckenberg, Tobias

AU - Payá Vayá, Guillermo

AU - Blume, Holger Christoph

PY - 2018

Y1 - 2018

N2 - Microcontroller units placed in harsh environments are manufactured using large semiconductor technology nodes in order to provide reliable operation even at high temperatures or increased radiation exposition. As a drawback, these large technology nodes provide rather high gate propagation delays drastically reducing the system performance. Additionally, when reducing area costs and power consumption, the actual processor architecture becomes a major design point. A processor architecture is defined by several parameters like data path width, type of instruction execution, or the actual underlying architectural design paradigm. This work presents a design space exploration of four different architecture paradigms implemented for a 0.35μm high temperature SOI CMOS technology.

AB - Microcontroller units placed in harsh environments are manufactured using large semiconductor technology nodes in order to provide reliable operation even at high temperatures or increased radiation exposition. As a drawback, these large technology nodes provide rather high gate propagation delays drastically reducing the system performance. Additionally, when reducing area costs and power consumption, the actual processor architecture becomes a major design point. A processor architecture is defined by several parameters like data path width, type of instruction execution, or the actual underlying architectural design paradigm. This work presents a design space exploration of four different architecture paradigms implemented for a 0.35μm high temperature SOI CMOS technology.

M3 - Paper

T2 - Cadence User Conference 2018

Y2 - 7 May 2018 through 9 May 2018

ER -

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