Details
| Original language | English |
|---|---|
| Article number | 8200209 |
| Journal | IEEE photonics journal |
| Volume | 13 |
| Issue number | 5 |
| Publication status | Published - 20 Aug 2021 |
| Externally published | Yes |
Abstract
MicroLED arrays with the capability of switching each pixel separately with high frequency can serve as structured micro-illumination light engines for applications in sensing, optogenetics, microscopy and many others. We describe a scalable chip process chain for the fabrication of passive-matrix microLED arrays, which were integrated with PCB-based driving electronics. The arrays were produced by deep-etching of conventional planar LED structures on sapphire, followed by filling and planarization steps. The pixel resolution lies in the range of 254 to 2540 pixels-per-inch (ppi), the arrays consist of 32 x 32 pixels. Optical output powers up to 50 μW per pixel were measured. In comparison to CMOS-based approaches, the presented technology is a simplified strategy to produce microLED arrays with high pixel counts.
Keywords
- III-V semiconductor materials, Inorganic light-emitting diodes, Micro-light emitting diode array
ASJC Scopus subject areas
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
- Engineering(all)
- Electrical and Electronic Engineering
Cite this
- Standard
- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
In: IEEE photonics journal, Vol. 13, No. 5, 8200209 , 20.08.2021.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Processing and characterization of monolithic passive-matrix GaN-based MicroLED arrays with pixel sizes from 5 to 50 μm
AU - Bornemann, Steffen
AU - Gulink, Jan
AU - Moro, Victor
AU - Gil, Joan Canals
AU - Wolter, Stefan
AU - Schottler, Georg
AU - Bezshlyakh, Daria
AU - Prades, Joan Daniel
AU - Dieguez, Angel
AU - Waag, Andreas
N1 - Funding Information: Manuscript received July 14, 2021; revised August 13, 2021; accepted August 16, 2021. Date of publication August 20, 2021; date of current version September 21, 2021. This work was was supported in part by within the European projects ChipScope and SMILE, which are funded by the European Union’s Horizon 2020 research and innovation program under Grant Agreements 737089 and 952135. The work was further supported in part by the Deutsche Forschungsge-meinschaft (DFG, German Research Foundation) under Germany’s Excellence Strategy – EXC-2123 QuantumFrontiers – 390837967 and within the Cluster of Excellence PhoenixD (EXC 2122, Project ID 390833453). (Corresponding authors: Steffen Bornemann; Andreas Waag.) Steffen Bornemann, Jan Gülink, Stefan Wolter, Georg Schöttler, Daria Bezshlyakh, and Andreas Waag are with the Institute of Semiconductor Technology, Technische Universität Braunschweig, 38106 Braunschweig, Germany, and also with the Laboratory for Emerging Nanometrology, Technische Universität Braunschweig, 38106 Braunschweig, Germany (e-mail: steffen.bornemann@tu-braun schweig.de; j.guelink@tu-braunschweig.de; stefan.wolter@tu-braunschweig. de; g.schoettler@tu-braunschweig.de; d.bezshlyakh@tu-braunschweig.de; a.waag@tu-braunschweig.de).
PY - 2021/8/20
Y1 - 2021/8/20
N2 - MicroLED arrays with the capability of switching each pixel separately with high frequency can serve as structured micro-illumination light engines for applications in sensing, optogenetics, microscopy and many others. We describe a scalable chip process chain for the fabrication of passive-matrix microLED arrays, which were integrated with PCB-based driving electronics. The arrays were produced by deep-etching of conventional planar LED structures on sapphire, followed by filling and planarization steps. The pixel resolution lies in the range of 254 to 2540 pixels-per-inch (ppi), the arrays consist of 32 x 32 pixels. Optical output powers up to 50 μW per pixel were measured. In comparison to CMOS-based approaches, the presented technology is a simplified strategy to produce microLED arrays with high pixel counts.
AB - MicroLED arrays with the capability of switching each pixel separately with high frequency can serve as structured micro-illumination light engines for applications in sensing, optogenetics, microscopy and many others. We describe a scalable chip process chain for the fabrication of passive-matrix microLED arrays, which were integrated with PCB-based driving electronics. The arrays were produced by deep-etching of conventional planar LED structures on sapphire, followed by filling and planarization steps. The pixel resolution lies in the range of 254 to 2540 pixels-per-inch (ppi), the arrays consist of 32 x 32 pixels. Optical output powers up to 50 μW per pixel were measured. In comparison to CMOS-based approaches, the presented technology is a simplified strategy to produce microLED arrays with high pixel counts.
KW - III-V semiconductor materials
KW - Inorganic light-emitting diodes
KW - Micro-light emitting diode array
UR - http://www.scopus.com/inward/record.url?scp=85113290834&partnerID=8YFLogxK
U2 - 10.1109/JPHOT.2021.3106584
DO - 10.1109/JPHOT.2021.3106584
M3 - Article
AN - SCOPUS:85113290834
VL - 13
JO - IEEE photonics journal
JF - IEEE photonics journal
SN - 1943-0655
IS - 5
M1 - 8200209
ER -