Printing of laser-generated conductive copper tracks on 3D components

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Authors

  • Ejvind Olsen
  • Ludger Overmeyer

Research Organisations

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Details

Original languageEnglish
Title of host publication2021 14th International Congress
Subtitle of host publicationMolded Interconnect Devices, MID 2021 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (electronic)9781728175096
ISBN (print)978-1-7281-7510-2
Publication statusPublished - 2021
Event14th International Congress Molded Interconnect Devices, MID 2021 - online, Virtual, Nurnberg, Germany
Duration: 8 Feb 2021 → 11 Feb 2021
Conference number: 14

Abstract

This research combines laser sintering and cleaning for the additive manufacturing of copper conductors on three-dimensional (3D) components. An application example shows the production of a conductive copper grid on a 3D antenna cover. The approach consists of full-surface coating with a primer and copper ink layer, followed by laser processing. The primer is applied to compensate for surface defects, ensure adequate insulation, and achieve thermal stability. Laser sintering creates conductive traces using the copper ink coating. In the last step of the production, laser cleaning removes the remaining non-sintered ink to ensure optimal electromagnetic characteristics. Finally, the 3D sintered conductive trace grids on an acrylonitrile butadiene styrene component results in an electrical resistance lower than 15 \Omega across the grid.

Keywords

    3D printed copper, copper ink coating, electromechanical 3D components, laser cleaning, laser sintering, priming

ASJC Scopus subject areas

Cite this

Printing of laser-generated conductive copper tracks on 3D components. / Olsen, Ejvind; Overmeyer, Ludger.
2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021. 9361618.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Olsen, E & Overmeyer, L 2021, Printing of laser-generated conductive copper tracks on 3D components. in 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings., 9361618, Institute of Electrical and Electronics Engineers Inc., 14th International Congress Molded Interconnect Devices, MID 2021, Virtual, Nurnberg, Germany, 8 Feb 2021. https://doi.org/10.1109/MID50463.2021.9361618
Olsen, E., & Overmeyer, L. (2021). Printing of laser-generated conductive copper tracks on 3D components. In 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings Article 9361618 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MID50463.2021.9361618
Olsen E, Overmeyer L. Printing of laser-generated conductive copper tracks on 3D components. In 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2021. 9361618 doi: 10.1109/MID50463.2021.9361618
Olsen, Ejvind ; Overmeyer, Ludger. / Printing of laser-generated conductive copper tracks on 3D components. 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021.
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@inproceedings{4eb9530f32e84089b25ea7d3a51d0c5e,
title = "Printing of laser-generated conductive copper tracks on 3D components",
abstract = "This research combines laser sintering and cleaning for the additive manufacturing of copper conductors on three-dimensional (3D) components. An application example shows the production of a conductive copper grid on a 3D antenna cover. The approach consists of full-surface coating with a primer and copper ink layer, followed by laser processing. The primer is applied to compensate for surface defects, ensure adequate insulation, and achieve thermal stability. Laser sintering creates conductive traces using the copper ink coating. In the last step of the production, laser cleaning removes the remaining non-sintered ink to ensure optimal electromagnetic characteristics. Finally, the 3D sintered conductive trace grids on an acrylonitrile butadiene styrene component results in an electrical resistance lower than 15 \Omega across the grid. ",
keywords = "3D printed copper, copper ink coating, electromechanical 3D components, laser cleaning, laser sintering, priming",
author = "Ejvind Olsen and Ludger Overmeyer",
note = "Funding Information: ACKNOWLEDGMENT The authors would like to thank the Federal Ministry for Economic Affairs and Energy (BMWi) for funding the project {"}3D-CopperPrint{"} of the AiF (Arbeitsgemeinschaft industrieller Forschungsvereinigungen {"}Otto von Guericke{"} e.V.) within the IGF (Industrielle Gemeinschaftsforschung), with the IGF project number 20133 N, and the German company {"}deister electronic GmbH{"} for working on a practice-oriented application example. The authors also thank all other members of the project committee for supporting the project. ; 14th International Congress Molded Interconnect Devices, MID 2021 ; Conference date: 08-02-2021 Through 11-02-2021",
year = "2021",
doi = "10.1109/MID50463.2021.9361618",
language = "English",
isbn = "978-1-7281-7510-2",
booktitle = "2021 14th International Congress",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

Download

TY - GEN

T1 - Printing of laser-generated conductive copper tracks on 3D components

AU - Olsen, Ejvind

AU - Overmeyer, Ludger

N1 - Conference code: 14

PY - 2021

Y1 - 2021

N2 - This research combines laser sintering and cleaning for the additive manufacturing of copper conductors on three-dimensional (3D) components. An application example shows the production of a conductive copper grid on a 3D antenna cover. The approach consists of full-surface coating with a primer and copper ink layer, followed by laser processing. The primer is applied to compensate for surface defects, ensure adequate insulation, and achieve thermal stability. Laser sintering creates conductive traces using the copper ink coating. In the last step of the production, laser cleaning removes the remaining non-sintered ink to ensure optimal electromagnetic characteristics. Finally, the 3D sintered conductive trace grids on an acrylonitrile butadiene styrene component results in an electrical resistance lower than 15 \Omega across the grid.

AB - This research combines laser sintering and cleaning for the additive manufacturing of copper conductors on three-dimensional (3D) components. An application example shows the production of a conductive copper grid on a 3D antenna cover. The approach consists of full-surface coating with a primer and copper ink layer, followed by laser processing. The primer is applied to compensate for surface defects, ensure adequate insulation, and achieve thermal stability. Laser sintering creates conductive traces using the copper ink coating. In the last step of the production, laser cleaning removes the remaining non-sintered ink to ensure optimal electromagnetic characteristics. Finally, the 3D sintered conductive trace grids on an acrylonitrile butadiene styrene component results in an electrical resistance lower than 15 \Omega across the grid.

KW - 3D printed copper

KW - copper ink coating

KW - electromechanical 3D components

KW - laser cleaning

KW - laser sintering

KW - priming

UR - http://www.scopus.com/inward/record.url?scp=85102530928&partnerID=8YFLogxK

U2 - 10.1109/MID50463.2021.9361618

DO - 10.1109/MID50463.2021.9361618

M3 - Conference contribution

AN - SCOPUS:85102530928

SN - 978-1-7281-7510-2

BT - 2021 14th International Congress

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 14th International Congress Molded Interconnect Devices, MID 2021

Y2 - 8 February 2021 through 11 February 2021

ER -