Porous metal bonds increase the resource efficiency for profile grinding II

Research output: Contribution to journalConference articleResearchpeer review

Authors

  • Berend Denkena
  • Thilo Grove
  • Marc André Dittrich
  • Vino Suntharakumaran
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Details

Original languageEnglish
Pages (from-to)114-119
Number of pages6
JournalProcedia CIRP
Volume80
Publication statusPublished - 4 May 2019
Event26th CIRP Conference on Life Cycle Engineering, LCE 2019 - West Lafayette, United States
Duration: 7 May 20199 May 2019

Abstract

Profile grinding is irreplaceable for the machining of various brittle and hard workpieces such as cutting tools, i.e. milling and boring tools, seal components made off ceramic as well as bearing components. Regarding the required energy for the machining of one volume element, grinding is inefficient compared to other manufacturing processes. By using grinding wheels with a porous metal bond and grains that tend to splinter the process forces can be reduced without influencing the tool wear. This allows for increasing the material removal rate while keeping the process forces on a constant level, ultimately reducing the energy consumption per workpiece manufactured. This paper focuses on the correlation between material removal rate, energy consumption, process temperatures and forces as well as the material removal mechanisms for the profile grinding of cemented carbide.

Keywords

    Brittle Materials, Metal Bond, Profile Grinding, Resource Efficiency

ASJC Scopus subject areas

Sustainable Development Goals

Cite this

Porous metal bonds increase the resource efficiency for profile grinding II. / Denkena, Berend; Grove, Thilo; Dittrich, Marc André et al.
In: Procedia CIRP, Vol. 80, 04.05.2019, p. 114-119.

Research output: Contribution to journalConference articleResearchpeer review

Denkena, B, Grove, T, Dittrich, MA & Suntharakumaran, V 2019, 'Porous metal bonds increase the resource efficiency for profile grinding II', Procedia CIRP, vol. 80, pp. 114-119. https://doi.org/10.1016/j.procir.2019.01.049
Denkena, B., Grove, T., Dittrich, M. A., & Suntharakumaran, V. (2019). Porous metal bonds increase the resource efficiency for profile grinding II. Procedia CIRP, 80, 114-119. https://doi.org/10.1016/j.procir.2019.01.049
Denkena B, Grove T, Dittrich MA, Suntharakumaran V. Porous metal bonds increase the resource efficiency for profile grinding II. Procedia CIRP. 2019 May 4;80:114-119. doi: 10.1016/j.procir.2019.01.049
Denkena, Berend ; Grove, Thilo ; Dittrich, Marc André et al. / Porous metal bonds increase the resource efficiency for profile grinding II. In: Procedia CIRP. 2019 ; Vol. 80. pp. 114-119.
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