Details
Original language | English |
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Title of host publication | 2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (electronic) | 9798350363517 |
ISBN (print) | 979-8-3503-6352-4 |
Publication status | Published - 20 Oct 2024 |
Event | 2024 IEEE Sensors, SENSORS 2024 - Kobe, Japan Duration: 20 Oct 2024 → 23 Oct 2024 |
Publication series
Name | Proceedings of IEEE Sensors |
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ISSN (Print) | 1930-0395 |
ISSN (electronic) | 2168-9229 |
Abstract
In the monitoring of mechanical components for lifetime prediction and detection of critical load conditions, especially strain gauges play a major role. They can be integrated into components to measure strain in the components themselves. This places special demands on the sensors used because of higher temperatures in the manufacturing phase of the components like additive manufacturing. This is why the sensors need to be polymer-free and cannot be applied with an adhesive. For this, directly deposited polymer-free sensors have been developed. In this article, the advantages of conventional polymer-foil based strain gauges (batch production) and directly deposited sensors (polymer-free) are combined by depositing the sensors on a metal foil and applying them polymer-free to metal specimens. This enables the batch production of strain gauges for use in harsh environments. Therefore, steel and aluminum foils were used as sensor carrier materials with aluminum oxide insulation layers and Platinum and NiCr sensor layers on the front side. On the back side, a tin layer was applied to enable thermocompressive bonding on the specimens leading to maximum tensile shear strengths of 10.7 MPa. After application, the sensors showed a k-factor of about 3.6 for the platinum sensors and about 2.4 for the NiCr sensors proving the functionality of the sensor concept.
Keywords
- direct deposition, harsh environments, high-temperature, k-factor, polymer-free, strain gauge, tensile shear strength, thermocompressive bonding, thin-film
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
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2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2024. (Proceedings of IEEE Sensors).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Polymer-Free Batch Production and Application of Metal Foil-Based Thin-Film Strain Gauges
AU - Ottermann, Rico
AU - Müller, Eileen
AU - Keßler, Marvin
AU - Dencker, Folke
AU - Klaas, Daniel
AU - Wurz, Marc Christopher
N1 - Publisher Copyright: © 2024 IEEE.
PY - 2024/10/20
Y1 - 2024/10/20
N2 - In the monitoring of mechanical components for lifetime prediction and detection of critical load conditions, especially strain gauges play a major role. They can be integrated into components to measure strain in the components themselves. This places special demands on the sensors used because of higher temperatures in the manufacturing phase of the components like additive manufacturing. This is why the sensors need to be polymer-free and cannot be applied with an adhesive. For this, directly deposited polymer-free sensors have been developed. In this article, the advantages of conventional polymer-foil based strain gauges (batch production) and directly deposited sensors (polymer-free) are combined by depositing the sensors on a metal foil and applying them polymer-free to metal specimens. This enables the batch production of strain gauges for use in harsh environments. Therefore, steel and aluminum foils were used as sensor carrier materials with aluminum oxide insulation layers and Platinum and NiCr sensor layers on the front side. On the back side, a tin layer was applied to enable thermocompressive bonding on the specimens leading to maximum tensile shear strengths of 10.7 MPa. After application, the sensors showed a k-factor of about 3.6 for the platinum sensors and about 2.4 for the NiCr sensors proving the functionality of the sensor concept.
AB - In the monitoring of mechanical components for lifetime prediction and detection of critical load conditions, especially strain gauges play a major role. They can be integrated into components to measure strain in the components themselves. This places special demands on the sensors used because of higher temperatures in the manufacturing phase of the components like additive manufacturing. This is why the sensors need to be polymer-free and cannot be applied with an adhesive. For this, directly deposited polymer-free sensors have been developed. In this article, the advantages of conventional polymer-foil based strain gauges (batch production) and directly deposited sensors (polymer-free) are combined by depositing the sensors on a metal foil and applying them polymer-free to metal specimens. This enables the batch production of strain gauges for use in harsh environments. Therefore, steel and aluminum foils were used as sensor carrier materials with aluminum oxide insulation layers and Platinum and NiCr sensor layers on the front side. On the back side, a tin layer was applied to enable thermocompressive bonding on the specimens leading to maximum tensile shear strengths of 10.7 MPa. After application, the sensors showed a k-factor of about 3.6 for the platinum sensors and about 2.4 for the NiCr sensors proving the functionality of the sensor concept.
KW - direct deposition
KW - harsh environments
KW - high-temperature
KW - k-factor
KW - polymer-free
KW - strain gauge
KW - tensile shear strength
KW - thermocompressive bonding
KW - thin-film
UR - http://www.scopus.com/inward/record.url?scp=85215325832&partnerID=8YFLogxK
U2 - 10.1109/SENSORS60989.2024.10784988
DO - 10.1109/SENSORS60989.2024.10784988
M3 - Conference contribution
AN - SCOPUS:85215325832
SN - 979-8-3503-6352-4
T3 - Proceedings of IEEE Sensors
BT - 2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE Sensors, SENSORS 2024
Y2 - 20 October 2024 through 23 October 2024
ER -