Piezoelectrical wire feeding system for micropositioning in bonding machines

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • A. Henke
  • M. A. Kuemmel
  • J. Wallaschek

External Research Organisations

  • Paderborn University
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Details

Original languageEnglish
Title of host publicationSmart Structures and Materials 1999: Smart Structures and Integrated Systems
Pages656-664
Number of pages9
Volume3668
EditionII
Publication statusPublished - 9 Jun 1999
Externally publishedYes
Event1999 Smart Structures and Materials - Smart Structures and Integrated Systems - Newport Beach, United States
Duration: 1 Mar 19991 Mar 1999

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
PublisherSPIE
ISSN (Print)0277-786X

Abstract

In this report a new wire feeding system for fine wire bonding machines and its development is presented. The system is driven by a piezoelectric actuator, which replaces the electromagnetic actuators used in present bonding machines. To minimize the time used to develop the piezoelectric system, several models of the system have been derived and simulations have been made, to optimize the systems performance. After the wire feeding system has been manufactured, experiments have been made to validate the results conceived from the simulations. The performance improvement to the currently used feeding system is discussed.

ASJC Scopus subject areas

Cite this

Piezoelectrical wire feeding system for micropositioning in bonding machines. / Henke, A.; Kuemmel, M. A.; Wallaschek, J.
Smart Structures and Materials 1999: Smart Structures and Integrated Systems. Vol. 3668 II. ed. 1999. p. 656-664 (Proceedings of SPIE - The International Society for Optical Engineering).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Henke, A, Kuemmel, MA & Wallaschek, J 1999, Piezoelectrical wire feeding system for micropositioning in bonding machines. in Smart Structures and Materials 1999: Smart Structures and Integrated Systems. II edn, vol. 3668, Proceedings of SPIE - The International Society for Optical Engineering, pp. 656-664, 1999 Smart Structures and Materials - Smart Structures and Integrated Systems, Newport Beach, California, United States, 1 Mar 1999. https://doi.org/10.1117/12.350740
Henke, A., Kuemmel, M. A., & Wallaschek, J. (1999). Piezoelectrical wire feeding system for micropositioning in bonding machines. In Smart Structures and Materials 1999: Smart Structures and Integrated Systems (II ed., Vol. 3668, pp. 656-664). (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.350740
Henke A, Kuemmel MA, Wallaschek J. Piezoelectrical wire feeding system for micropositioning in bonding machines. In Smart Structures and Materials 1999: Smart Structures and Integrated Systems. II ed. Vol. 3668. 1999. p. 656-664. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.350740
Henke, A. ; Kuemmel, M. A. ; Wallaschek, J. / Piezoelectrical wire feeding system for micropositioning in bonding machines. Smart Structures and Materials 1999: Smart Structures and Integrated Systems. Vol. 3668 II. ed. 1999. pp. 656-664 (Proceedings of SPIE - The International Society for Optical Engineering).
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