Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

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Original languageEnglish
Title of host publication2020 IEEE Photonics Conference, IPC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (electronic)9781728158914
ISBN (print)978-1-7281-5892-1
Publication statusPublished - 2020
Event2020 IEEE Photonics Conference, IPC 2020 - Virtual, Vancouver, Canada
Duration: 28 Sept 20201 Oct 2020

Abstract

The thermal management of optical components on polymer substrates is crucial. Active components such as laser diodes produce heat which degenerates polymer substrates. Therefore, a thermal management concept is addressed to run active components within their specifications as well as keeping the substrate from damage.

Keywords

    active cooling, bonding, foil substrates, laser diodes, passive cooling, polymer, soldering, thermal management

ASJC Scopus subject areas

Cite this

Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. / Bengsch, Sebastian; Wurz, Marc Christopher.
2020 IEEE Photonics Conference, IPC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9252383.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Bengsch, S & Wurz, MC 2020, Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. in 2020 IEEE Photonics Conference, IPC 2020., 9252383, Institute of Electrical and Electronics Engineers Inc., 2020 IEEE Photonics Conference, IPC 2020, Virtual, Vancouver, Canada, 28 Sept 2020. https://doi.org/10.1109/IPC47351.2020.9252383
Bengsch, S., & Wurz, M. C. (2020). Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. In 2020 IEEE Photonics Conference, IPC 2020 Article 9252383 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPC47351.2020.9252383
Bengsch S, Wurz MC. Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. In 2020 IEEE Photonics Conference, IPC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9252383 doi: 10.1109/IPC47351.2020.9252383
Bengsch, Sebastian ; Wurz, Marc Christopher. / Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. 2020 IEEE Photonics Conference, IPC 2020. Institute of Electrical and Electronics Engineers Inc., 2020.
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keywords = "active cooling, bonding, foil substrates, laser diodes, passive cooling, polymer, soldering, thermal management",
author = "Sebastian Bengsch and Wurz, {Marc Christopher}",
note = "Funding Information: I would like to thank the Cluster of Excellence PhoenixD (Photonics, Optics, and Engineering – Innovation Across Disciplines), Hannover, Germany funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany{\textquoteright}s Excellence Strategy within the Cluster of Excellence PhoenixD (EXC 2122, Project ID 390833453); 2020 IEEE Photonics Conference, IPC 2020 ; Conference date: 28-09-2020 Through 01-10-2020",
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KW - bonding

KW - foil substrates

KW - laser diodes

KW - passive cooling

KW - polymer

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