Parametric grinding wheel model for material removal simulation of tool grinding processes

Research output: Contribution to journalConference articleResearchpeer review

Authors

  • M. A. Dittrich
  • B. Denkena
  • M. Wichmann
View graph of relations

Details

Original languageEnglish
Pages (from-to)381-386
Number of pages6
JournalProcedia CIRP
Volume102
Early online date27 Sept 2021
Publication statusPublished - 2021
Event18th CIRP Conference on Modeling of Machining Operations, CMMO 2021 - Ljubljana, Slovenia
Duration: 15 Jun 202117 Jun 2021

Abstract

Tool grinding is an essential process for the production of cemented carbide tools. In that context, the investigation of specific effects like the resulting surface profile and the fluid dynamic processes is of great interest, but requires microscopic modeling of the grinding wheel including its individual grains and bonding material. This paper introduces an approach for a parametric grinding wheel model, which provides a topography on microscopic scale depending on the grinding wheel specification and dressing conditions for subsequent use in material removal simulations. Scalable abrasive grains and variable distributions embedded in a shiftable bond layer are applied. Optical laser scans are used to derive surface parameters for an adaption and evaluation of the model. The prediction quality in terms of surface roughness is evaluated in surface grinding reference experiments.

Keywords

    Grinding, Material removal, Modeling

ASJC Scopus subject areas

Cite this

Parametric grinding wheel model for material removal simulation of tool grinding processes. / Dittrich, M. A.; Denkena, B.; Wichmann, M.
In: Procedia CIRP, Vol. 102, 2021, p. 381-386.

Research output: Contribution to journalConference articleResearchpeer review

Dittrich MA, Denkena B, Wichmann M. Parametric grinding wheel model for material removal simulation of tool grinding processes. Procedia CIRP. 2021;102:381-386. Epub 2021 Sept 27. doi: 10.1016/j.procir.2021.09.065
Dittrich, M. A. ; Denkena, B. ; Wichmann, M. / Parametric grinding wheel model for material removal simulation of tool grinding processes. In: Procedia CIRP. 2021 ; Vol. 102. pp. 381-386.
Download
@article{4cd557392f51442296d033f2d2eb02b1,
title = "Parametric grinding wheel model for material removal simulation of tool grinding processes",
abstract = "Tool grinding is an essential process for the production of cemented carbide tools. In that context, the investigation of specific effects like the resulting surface profile and the fluid dynamic processes is of great interest, but requires microscopic modeling of the grinding wheel including its individual grains and bonding material. This paper introduces an approach for a parametric grinding wheel model, which provides a topography on microscopic scale depending on the grinding wheel specification and dressing conditions for subsequent use in material removal simulations. Scalable abrasive grains and variable distributions embedded in a shiftable bond layer are applied. Optical laser scans are used to derive surface parameters for an adaption and evaluation of the model. The prediction quality in terms of surface roughness is evaluated in surface grinding reference experiments. ",
keywords = "Grinding, Material removal, Modeling",
author = "Dittrich, {M. A.} and B. Denkena and M. Wichmann",
year = "2021",
doi = "10.1016/j.procir.2021.09.065",
language = "English",
volume = "102",
pages = "381--386",
note = "18th CIRP Conference on Modeling of Machining Operations, CMMO 2021 ; Conference date: 15-06-2021 Through 17-06-2021",

}

Download

TY - JOUR

T1 - Parametric grinding wheel model for material removal simulation of tool grinding processes

AU - Dittrich, M. A.

AU - Denkena, B.

AU - Wichmann, M.

PY - 2021

Y1 - 2021

N2 - Tool grinding is an essential process for the production of cemented carbide tools. In that context, the investigation of specific effects like the resulting surface profile and the fluid dynamic processes is of great interest, but requires microscopic modeling of the grinding wheel including its individual grains and bonding material. This paper introduces an approach for a parametric grinding wheel model, which provides a topography on microscopic scale depending on the grinding wheel specification and dressing conditions for subsequent use in material removal simulations. Scalable abrasive grains and variable distributions embedded in a shiftable bond layer are applied. Optical laser scans are used to derive surface parameters for an adaption and evaluation of the model. The prediction quality in terms of surface roughness is evaluated in surface grinding reference experiments.

AB - Tool grinding is an essential process for the production of cemented carbide tools. In that context, the investigation of specific effects like the resulting surface profile and the fluid dynamic processes is of great interest, but requires microscopic modeling of the grinding wheel including its individual grains and bonding material. This paper introduces an approach for a parametric grinding wheel model, which provides a topography on microscopic scale depending on the grinding wheel specification and dressing conditions for subsequent use in material removal simulations. Scalable abrasive grains and variable distributions embedded in a shiftable bond layer are applied. Optical laser scans are used to derive surface parameters for an adaption and evaluation of the model. The prediction quality in terms of surface roughness is evaluated in surface grinding reference experiments.

KW - Grinding

KW - Material removal

KW - Modeling

UR - http://www.scopus.com/inward/record.url?scp=85116923600&partnerID=8YFLogxK

U2 - 10.1016/j.procir.2021.09.065

DO - 10.1016/j.procir.2021.09.065

M3 - Conference article

AN - SCOPUS:85116923600

VL - 102

SP - 381

EP - 386

JO - Procedia CIRP

JF - Procedia CIRP

SN - 2212-8271

T2 - 18th CIRP Conference on Modeling of Machining Operations, CMMO 2021

Y2 - 15 June 2021 through 17 June 2021

ER -