Details
| Original language | English |
|---|---|
| Title of host publication | Semiconductor Devices in Harsh Conditions |
| Pages | 135-147 |
| Number of pages | 13 |
| ISBN (electronic) | 9781498743822 |
| Publication status | Published - 25 Nov 2016 |
Abstract
The request for packaging technologies which enable elec tronic devices to operate under harsh environments is always increasing. The main challenge is the encapsulation of electronic circuits to save them from external thermal influences and to resist fast thermal gradients. Other aspects of harsh environments are radioactive, chemical, electromagnetic and high-pressure surroundings. For all of these special influences, different embodiments for the packaging must be chosen. For example, for industrial applications ceramic is often used to ensure a long-term stability of about 10 years. This chapter gives an overview of the different techniques for the fabrication of packages for operation under harsh environments.
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
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Semiconductor Devices in Harsh Conditions. 2016. p. 135-147.
Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
}
TY - CHAP
T1 - Packaging for systems in harsh environments
AU - Wurz, Marc Christopher
AU - Bengsch, Sebastian
N1 - Publisher Copyright: © 2017 by Taylor & Francis Group, LLC. All rights reserved. Copyright: Copyright 2019 Elsevier B.V., All rights reserved.
PY - 2016/11/25
Y1 - 2016/11/25
N2 - The request for packaging technologies which enable elec tronic devices to operate under harsh environments is always increasing. The main challenge is the encapsulation of electronic circuits to save them from external thermal influences and to resist fast thermal gradients. Other aspects of harsh environments are radioactive, chemical, electromagnetic and high-pressure surroundings. For all of these special influences, different embodiments for the packaging must be chosen. For example, for industrial applications ceramic is often used to ensure a long-term stability of about 10 years. This chapter gives an overview of the different techniques for the fabrication of packages for operation under harsh environments.
AB - The request for packaging technologies which enable elec tronic devices to operate under harsh environments is always increasing. The main challenge is the encapsulation of electronic circuits to save them from external thermal influences and to resist fast thermal gradients. Other aspects of harsh environments are radioactive, chemical, electromagnetic and high-pressure surroundings. For all of these special influences, different embodiments for the packaging must be chosen. For example, for industrial applications ceramic is often used to ensure a long-term stability of about 10 years. This chapter gives an overview of the different techniques for the fabrication of packages for operation under harsh environments.
UR - http://www.scopus.com/inward/record.url?scp=85052213324&partnerID=8YFLogxK
U2 - 10.1201/9781315368948
DO - 10.1201/9781315368948
M3 - Contribution to book/anthology
AN - SCOPUS:85052213324
SN - 9781498743808
SP - 135
EP - 147
BT - Semiconductor Devices in Harsh Conditions
ER -