Details
| Original language | English |
|---|---|
| Pages (from-to) | 41-44 |
| Number of pages | 4 |
| Journal | CIRP annals |
| Volume | 71 |
| Issue number | 1 |
| Early online date | 25 May 2022 |
| Publication status | Published - 2022 |
Abstract
Die bonders are faster than ever at 42,000 units per hour (UPH) these days. However, the die transfer process is often the limiting time constraint due to the inertia of the mechanical actuators. In addition, the mechanical die ejection physically limits the minimum possible die dimensions. To overcome these limitations we developed a laser-induced on-the-fly bare die bonding technology. Experimental results verify, this technology significantly accelerates the die ejection process and enables up to 108,000 UPH. Further, this technology opens up possibilities for efficient and novel concepts for automatable production, e.g. for flexible ultra-thin wafers.
Keywords
- Bonding, Laser, On-the-fly die assembly
ASJC Scopus subject areas
- Engineering(all)
- Mechanical Engineering
- Engineering(all)
- Industrial and Manufacturing Engineering
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In: CIRP annals, Vol. 71, No. 1, 2022, p. 41-44.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - On-the-fly bare die bonding based on laser induced forward transfer (LIFT)
AU - Overmeyer, Ludger
AU - Gottwald, Simon Nicolas
AU - Springer, Matthias
AU - Düsing, Jan Friedrich
N1 - Funding Information: Funding programs: German Federal Ministry of Education and Research fund this research within the funding program Photonics Research Germany, contract numbers 13N14654 and 13N14655. German Research Foundation under Germany's Excellence Strategy within the Cluster of Excellence PhoenixD (EXC 2122, Project ID 390833453).
PY - 2022
Y1 - 2022
N2 - Die bonders are faster than ever at 42,000 units per hour (UPH) these days. However, the die transfer process is often the limiting time constraint due to the inertia of the mechanical actuators. In addition, the mechanical die ejection physically limits the minimum possible die dimensions. To overcome these limitations we developed a laser-induced on-the-fly bare die bonding technology. Experimental results verify, this technology significantly accelerates the die ejection process and enables up to 108,000 UPH. Further, this technology opens up possibilities for efficient and novel concepts for automatable production, e.g. for flexible ultra-thin wafers.
AB - Die bonders are faster than ever at 42,000 units per hour (UPH) these days. However, the die transfer process is often the limiting time constraint due to the inertia of the mechanical actuators. In addition, the mechanical die ejection physically limits the minimum possible die dimensions. To overcome these limitations we developed a laser-induced on-the-fly bare die bonding technology. Experimental results verify, this technology significantly accelerates the die ejection process and enables up to 108,000 UPH. Further, this technology opens up possibilities for efficient and novel concepts for automatable production, e.g. for flexible ultra-thin wafers.
KW - Bonding
KW - Laser
KW - On-the-fly die assembly
UR - http://www.scopus.com/inward/record.url?scp=85130889098&partnerID=8YFLogxK
U2 - 10.1016/j.cirp.2022.03.042
DO - 10.1016/j.cirp.2022.03.042
M3 - Article
AN - SCOPUS:85130889098
VL - 71
SP - 41
EP - 44
JO - CIRP annals
JF - CIRP annals
SN - 0007-8506
IS - 1
ER -