Details
| Original language | English |
|---|---|
| Pages (from-to) | 1066-1074 |
| Number of pages | 9 |
| Journal | Advanced engineering materials |
| Volume | 18 |
| Issue number | 6 |
| Publication status | Published - 11 Feb 2016 |
Abstract
Interface modification based on ultra-thin mercapto-propyl(trimethoxy)silane (MPTMS) films is shown to promote joining of copper and aluminum by plastic deformation followed by a heat treatment. The surface morphology and the surface chemistry of the metal substrates were analyzed by means of FE-SEM, XPS, and FT-IRRAS. The spectroscopic data show that the MPTMS film is crosslinked via Si–O–Si bonds and that stable Cu–S and Si–O–Al interfacial bonds are formed. The shear-force tests of the joints led to force displacement curves that are characteristic for a covalently bonded interface. Complementary cross sectional SEM and EDS analysis of the joint proved that a defect-free interface was formed without any measureable interdiffusion of metals across the interface or cracking of an oxide films.
ASJC Scopus subject areas
- Materials Science(all)
- General Materials Science
- Physics and Astronomy(all)
- Condensed Matter Physics
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In: Advanced engineering materials, Vol. 18, No. 6, 11.02.2016, p. 1066-1074.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Molecular Engineering of Aluminum–Copper Interfaces for Joining by Plastic Deformation
AU - Hoppe, Christian
AU - Ebbert, Christoph
AU - Voigt, Markus
AU - Schmidt, Hans Christian
AU - Rodman, Dmytro
AU - Homberg, Werner
AU - Maier, Hans Jürgen
AU - Grundmeier, Guido
PY - 2016/2/11
Y1 - 2016/2/11
N2 - Interface modification based on ultra-thin mercapto-propyl(trimethoxy)silane (MPTMS) films is shown to promote joining of copper and aluminum by plastic deformation followed by a heat treatment. The surface morphology and the surface chemistry of the metal substrates were analyzed by means of FE-SEM, XPS, and FT-IRRAS. The spectroscopic data show that the MPTMS film is crosslinked via Si–O–Si bonds and that stable Cu–S and Si–O–Al interfacial bonds are formed. The shear-force tests of the joints led to force displacement curves that are characteristic for a covalently bonded interface. Complementary cross sectional SEM and EDS analysis of the joint proved that a defect-free interface was formed without any measureable interdiffusion of metals across the interface or cracking of an oxide films.
AB - Interface modification based on ultra-thin mercapto-propyl(trimethoxy)silane (MPTMS) films is shown to promote joining of copper and aluminum by plastic deformation followed by a heat treatment. The surface morphology and the surface chemistry of the metal substrates were analyzed by means of FE-SEM, XPS, and FT-IRRAS. The spectroscopic data show that the MPTMS film is crosslinked via Si–O–Si bonds and that stable Cu–S and Si–O–Al interfacial bonds are formed. The shear-force tests of the joints led to force displacement curves that are characteristic for a covalently bonded interface. Complementary cross sectional SEM and EDS analysis of the joint proved that a defect-free interface was formed without any measureable interdiffusion of metals across the interface or cracking of an oxide films.
UR - http://www.scopus.com/inward/record.url?scp=84958669839&partnerID=8YFLogxK
U2 - 10.1002/adem.201500501
DO - 10.1002/adem.201500501
M3 - Article
AN - SCOPUS:84958669839
VL - 18
SP - 1066
EP - 1074
JO - Advanced engineering materials
JF - Advanced engineering materials
SN - 1438-1656
IS - 6
ER -