Details
| Original language | English |
|---|---|
| Pages | 145-148 |
| Number of pages | 4 |
| Publication status | Published - 1997 |
| Event | 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging - San Jose, United States Duration: 27 Oct 1997 → 29 Oct 1997 |
Conference
| Conference | 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | San Jose |
| Period | 27 Oct 1997 → 29 Oct 1997 |
Abstract
A new approach for the time-domain analysis of transmission lines exposed to arbitrary external fields is presented. The approach is robust enough to make it compatible with virtually any line model and circuit simulator. The deviation between exact values and simulation results is less than 1%.
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
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1997. 145-148 Paper presented at 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, California, United States.
Research output: Contribution to conference › Paper › Research › peer review
}
TY - CONF
T1 - Modelling and simulation of electromagnetic interference in electronic circuits
AU - Nordholz, Petra
AU - Grabinski, Hartmut
PY - 1997
Y1 - 1997
N2 - A new approach for the time-domain analysis of transmission lines exposed to arbitrary external fields is presented. The approach is robust enough to make it compatible with virtually any line model and circuit simulator. The deviation between exact values and simulation results is less than 1%.
AB - A new approach for the time-domain analysis of transmission lines exposed to arbitrary external fields is presented. The approach is robust enough to make it compatible with virtually any line model and circuit simulator. The deviation between exact values and simulation results is less than 1%.
UR - http://www.scopus.com/inward/record.url?scp=0031357620&partnerID=8YFLogxK
U2 - 10.1109/EPEP.1997.634058
DO - 10.1109/EPEP.1997.634058
M3 - Paper
AN - SCOPUS:0031357620
SP - 145
EP - 148
T2 - 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging
Y2 - 27 October 1997 through 29 October 1997
ER -