Details
| Original language | English |
|---|---|
| Title of host publication | ASME 2005 International Mechanical Engineering Congress and Exposition (IMECE2005) |
| Pages | 219-226 |
| Number of pages | 8 |
| Publication status | Published - 5 Feb 2005 |
| Externally published | Yes |
| Event | 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005 - Orlando, FL, United States Duration: 5 Nov 2005 → 11 Nov 2005 |
Publication series
| Name | International Mechanical Engineering Congress and Exposition (IMECE) |
|---|
Abstract
Quality monitoring in microelectronics becomes more and more important because of the constantly rising complexity and miniaturization of modern microelectronic devices. This paper describes a model based method for online quality monitoring in ultrasonic wire bonding. This new approach aims to reconstruct the metallophysical processes within the bonding zone by the aid of a validated analytical model of the bonding system. The model comprises a 2-DOF electromechanical analogous circuit representing the ultrasonic transducer, a phase-locked-loop controller for frequency control and time varying spring-damper elements representing the bond process. It will be shown how faulty bonds can clearly be identified by this method.
Keywords
- Model based, Quality monitoring, Transient load estimation, Ultrasonic wire bonding
ASJC Scopus subject areas
- Engineering(all)
- Mechanical Engineering
- Earth and Planetary Sciences(all)
- Space and Planetary Science
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ASME 2005 International Mechanical Engineering Congress and Exposition (IMECE2005). 2005. p. 219-226 (International Mechanical Engineering Congress and Exposition (IMECE)).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Model based development of an integrated sensor-actuator system for online quality monitoring in ultrasonic wire bonding
AU - Brökelmann, Michael
AU - Wallaschek, Jörg
AU - Hesse, Hans J.
N1 - Copyright: Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2005/2/5
Y1 - 2005/2/5
N2 - Quality monitoring in microelectronics becomes more and more important because of the constantly rising complexity and miniaturization of modern microelectronic devices. This paper describes a model based method for online quality monitoring in ultrasonic wire bonding. This new approach aims to reconstruct the metallophysical processes within the bonding zone by the aid of a validated analytical model of the bonding system. The model comprises a 2-DOF electromechanical analogous circuit representing the ultrasonic transducer, a phase-locked-loop controller for frequency control and time varying spring-damper elements representing the bond process. It will be shown how faulty bonds can clearly be identified by this method.
AB - Quality monitoring in microelectronics becomes more and more important because of the constantly rising complexity and miniaturization of modern microelectronic devices. This paper describes a model based method for online quality monitoring in ultrasonic wire bonding. This new approach aims to reconstruct the metallophysical processes within the bonding zone by the aid of a validated analytical model of the bonding system. The model comprises a 2-DOF electromechanical analogous circuit representing the ultrasonic transducer, a phase-locked-loop controller for frequency control and time varying spring-damper elements representing the bond process. It will be shown how faulty bonds can clearly be identified by this method.
KW - Model based
KW - Quality monitoring
KW - Transient load estimation
KW - Ultrasonic wire bonding
UR - http://www.scopus.com/inward/record.url?scp=33645660302&partnerID=8YFLogxK
U2 - 10.1115/IMECE2005-80790
DO - 10.1115/IMECE2005-80790
M3 - Conference contribution
AN - SCOPUS:33645660302
SN - 079184210X
SN - 9780791842102
T3 - International Mechanical Engineering Congress and Exposition (IMECE)
SP - 219
EP - 226
BT - ASME 2005 International Mechanical Engineering Congress and Exposition (IMECE2005)
T2 - 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005
Y2 - 5 November 2005 through 11 November 2005
ER -