Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern

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Translated title of the contributionMicrotechnological Production of Integrated Optical Gratings by means of a Lift-Off Process for Use in Atomic Interferometers
Original languageGerman
Title of host publicationMikroSystemTechnik Kongress 2021
Subtitle of host publicationMikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings
PublisherVDE Verlag GmbH
Pages466-468
Number of pages3
ISBN (electronic)9783800756575
Publication statusPublished - 2021
EventMikroSystemTechnik Congress 2021: Microelectronics, Microsystems Engineering and their Applications - Innovative Products for Future-Oriented Markets - Stuttgart-Ludwigsburg, Germany
Duration: 8 Nov 202110 Nov 2021

Publication series

NameMikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings

Abstract

At the Institute of Microproduction Technology of Leibniz University Hanover, in cooperation with the Institute of Quantum Optics, atom chips are developed and manufactured which are part of a magneto-optical trap (MOT) for compact matter wave interferometers. In the past, first investigations in the laboratory and under real conditions have been successfully performed. For this purpose, the first Bose-Einstein-Condensate (BEC), which is necessary for matter wave interferometry, was generated in the QUANTUS project [1]. The follow-up project QUANTUS-2 led to a miniaturization of the setup and to testing in drop tower experiments [2]. With the knowledge gained, a BEC was generated in space and detected and characterized by means of atomic interference as part of the MAIUS-1 mission [3]. These high-precision matter-wave interferometers offer advantages over classical laser interferometers in terms of measurement precision, reproducibility, and obsoleteness of calibration and maintenance. Due to the stationary design and the high complexity, the use for commercial purposes is made difficult. This requires fiarther miniaturization and integration of the overall system.

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Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern. / de Wall, S.; Kassner, A.; Dencker, F. et al.
MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. p. 466-468 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

de Wall, S, Kassner, A, Dencker, F, Künzler, C, Diekmann, L & Würz, MC 2021, Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern. in MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings, VDE Verlag GmbH, pp. 466-468, MikroSystemTechnik Congress 2021, Stuttgart-Ludwigsburg, Germany, 8 Nov 2021.
de Wall, S., Kassner, A., Dencker, F., Künzler, C., Diekmann, L., & Würz, M. C. (2021). Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern. In MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings (pp. 466-468). (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings). VDE Verlag GmbH.
de Wall S, Kassner A, Dencker F, Künzler C, Diekmann L, Würz MC. Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern. In MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH. 2021. p. 466-468. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).
de Wall, S. ; Kassner, A. ; Dencker, F. et al. / Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern. MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. pp. 466-468 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).
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AB - At the Institute of Microproduction Technology of Leibniz University Hanover, in cooperation with the Institute of Quantum Optics, atom chips are developed and manufactured which are part of a magneto-optical trap (MOT) for compact matter wave interferometers. In the past, first investigations in the laboratory and under real conditions have been successfully performed. For this purpose, the first Bose-Einstein-Condensate (BEC), which is necessary for matter wave interferometry, was generated in the QUANTUS project [1]. The follow-up project QUANTUS-2 led to a miniaturization of the setup and to testing in drop tower experiments [2]. With the knowledge gained, a BEC was generated in space and detected and characterized by means of atomic interference as part of the MAIUS-1 mission [3]. These high-precision matter-wave interferometers offer advantages over classical laser interferometers in terms of measurement precision, reproducibility, and obsoleteness of calibration and maintenance. Due to the stationary design and the high complexity, the use for commercial purposes is made difficult. This requires fiarther miniaturization and integration of the overall system.

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