Details
| Original language | English |
|---|---|
| Article number | 150504 |
| Journal | Applied physics letters |
| Volume | 125 |
| Issue number | 15 |
| Publication status | Published - 7 Oct 2024 |
| Externally published | Yes |
Abstract
MicroLEDs, particularly when integrated with CMOS microelectronics, represent a significant advancement in nitride technology. While large-area, high-power LEDs for solid-state lighting have seen extensive optimization, microLEDs present unique fabrication and characterization challenges. Utilizing standard CMOS design and foundry services for silicon driver electronics, a new hybrid interconnect technology must be developed for chip-chip or wafer-wafer integration, necessitating much higher lateral resolution than current bonding technologies. Beyond display technology, microLED integration opens avenues for groundbreaking applications such as highly efficient nanosensors, miniaturized optical neuromorphic networks, and robust chip-based microscopy. This paper explores recent advancements in nitride/CMOS hybrid modules, providing an overview of current technologies and future possibilities in this dynamic field.
ASJC Scopus subject areas
- Physics and Astronomy(all)
- Physics and Astronomy (miscellaneous)
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In: Applied physics letters, Vol. 125, No. 15, 150504, 07.10.2024.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - MicroLED arrays
T2 - A perspective beyond displays
AU - Prades, J. D.
AU - Meierhofer, F.
AU - Diéguez, A.
AU - Waag, A.
N1 - Publisher Copyright: © 2024 Author(s).
PY - 2024/10/7
Y1 - 2024/10/7
N2 - MicroLEDs, particularly when integrated with CMOS microelectronics, represent a significant advancement in nitride technology. While large-area, high-power LEDs for solid-state lighting have seen extensive optimization, microLEDs present unique fabrication and characterization challenges. Utilizing standard CMOS design and foundry services for silicon driver electronics, a new hybrid interconnect technology must be developed for chip-chip or wafer-wafer integration, necessitating much higher lateral resolution than current bonding technologies. Beyond display technology, microLED integration opens avenues for groundbreaking applications such as highly efficient nanosensors, miniaturized optical neuromorphic networks, and robust chip-based microscopy. This paper explores recent advancements in nitride/CMOS hybrid modules, providing an overview of current technologies and future possibilities in this dynamic field.
AB - MicroLEDs, particularly when integrated with CMOS microelectronics, represent a significant advancement in nitride technology. While large-area, high-power LEDs for solid-state lighting have seen extensive optimization, microLEDs present unique fabrication and characterization challenges. Utilizing standard CMOS design and foundry services for silicon driver electronics, a new hybrid interconnect technology must be developed for chip-chip or wafer-wafer integration, necessitating much higher lateral resolution than current bonding technologies. Beyond display technology, microLED integration opens avenues for groundbreaking applications such as highly efficient nanosensors, miniaturized optical neuromorphic networks, and robust chip-based microscopy. This paper explores recent advancements in nitride/CMOS hybrid modules, providing an overview of current technologies and future possibilities in this dynamic field.
UR - http://www.scopus.com/inward/record.url?scp=85206883392&partnerID=8YFLogxK
U2 - 10.1063/5.0223867
DO - 10.1063/5.0223867
M3 - Article
AN - SCOPUS:85206883392
VL - 125
JO - Applied physics letters
JF - Applied physics letters
SN - 0003-6951
IS - 15
M1 - 150504
ER -