Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications

Research output: Contribution to journalArticleResearchpeer review

Authors

  • Dragan Dinulovic
  • Mahmoud Shousha
  • Martin Haug
  • Alexander Gerfer
  • Sebastian Beringer
  • Marc Christopher Wurz
  • Jef Thone
  • Mike Wens

External Research Organisations

  • Cairo University
  • MinDCet NV
  • Würth Elektronik eiSos GmbH & Co. KG
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Details

Original languageEnglish
Article number8732443
Pages (from-to)5068-5077
Number of pages10
JournalIEEE Transactions on Industry Applications
Volume55
Issue number5
Publication statusPublished - 2019

Abstract

This paper presents the design, fabrication, and characterization on silicon integrated magnetics for high-frequency power applications. The presented device achieves superior characteristics in terms of energy density, electrical resistance, current capability, and inductance versus frequency stability. In order to demonstrate the effectiveness of use of the presented device for high-frequency power applications, it is tested with two different buck point of load (PoL) dc-dc converters, one of them is off-shelf chipset and the other is designed specifically for the microdevice. Experimental measurements show that the microdevices achieve a maximum inductance of about 50 nH, electrical resistance of 300 mΩ, rated current capabilities up to 1 A, and stable L versus f characteristics up to 100 MHz. Also, the PoL buck converters with the microdevices achieve a peak efficiency of up to 82% with a flat efficiency curve at switching frequencies up to 30 MHz while providing tight output voltage regulation (<0.2%) and low temperature rise (40 °C) at the rated current.

Keywords

    DC-DC converters, high switching frequency, magnetics on silicon, microinductor, microtransformer, point of load (PoL), power conversion, power transformer, switched-mode power supply

ASJC Scopus subject areas

Cite this

Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications. / Dinulovic, Dragan; Shousha, Mahmoud; Haug, Martin et al.
In: IEEE Transactions on Industry Applications, Vol. 55, No. 5, 8732443, 2019, p. 5068-5077.

Research output: Contribution to journalArticleResearchpeer review

Dinulovic, D, Shousha, M, Haug, M, Gerfer, A, Beringer, S, Wurz, MC, Thone, J & Wens, M 2019, 'Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications', IEEE Transactions on Industry Applications, vol. 55, no. 5, 8732443, pp. 5068-5077. https://doi.org/10.1109/TIA.2019.2921523
Dinulovic, D., Shousha, M., Haug, M., Gerfer, A., Beringer, S., Wurz, M. C., Thone, J., & Wens, M. (2019). Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications. IEEE Transactions on Industry Applications, 55(5), 5068-5077. Article 8732443. https://doi.org/10.1109/TIA.2019.2921523
Dinulovic D, Shousha M, Haug M, Gerfer A, Beringer S, Wurz MC et al. Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications. IEEE Transactions on Industry Applications. 2019;55(5):5068-5077. 8732443. doi: 10.1109/TIA.2019.2921523
Dinulovic, Dragan ; Shousha, Mahmoud ; Haug, Martin et al. / Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications. In: IEEE Transactions on Industry Applications. 2019 ; Vol. 55, No. 5. pp. 5068-5077.
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@article{18f215f38e4941d1b9c12e613a54e19c,
title = "Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications",
abstract = "This paper presents the design, fabrication, and characterization on silicon integrated magnetics for high-frequency power applications. The presented device achieves superior characteristics in terms of energy density, electrical resistance, current capability, and inductance versus frequency stability. In order to demonstrate the effectiveness of use of the presented device for high-frequency power applications, it is tested with two different buck point of load (PoL) dc-dc converters, one of them is off-shelf chipset and the other is designed specifically for the microdevice. Experimental measurements show that the microdevices achieve a maximum inductance of about 50 nH, electrical resistance of 300 mΩ, rated current capabilities up to 1 A, and stable L versus f characteristics up to 100 MHz. Also, the PoL buck converters with the microdevices achieve a peak efficiency of up to 82% with a flat efficiency curve at switching frequencies up to 30 MHz while providing tight output voltage regulation (<0.2%) and low temperature rise (40 °C) at the rated current.",
keywords = "DC-DC converters, high switching frequency, magnetics on silicon, microinductor, microtransformer, point of load (PoL), power conversion, power transformer, switched-mode power supply",
author = "Dragan Dinulovic and Mahmoud Shousha and Martin Haug and Alexander Gerfer and Sebastian Beringer and Wurz, {Marc Christopher} and Jef Thone and Mike Wens",
year = "2019",
doi = "10.1109/TIA.2019.2921523",
language = "English",
volume = "55",
pages = "5068--5077",
journal = "IEEE Transactions on Industry Applications",
issn = "0093-9994",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "5",

}

Download

TY - JOUR

T1 - Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications

AU - Dinulovic, Dragan

AU - Shousha, Mahmoud

AU - Haug, Martin

AU - Gerfer, Alexander

AU - Beringer, Sebastian

AU - Wurz, Marc Christopher

AU - Thone, Jef

AU - Wens, Mike

PY - 2019

Y1 - 2019

N2 - This paper presents the design, fabrication, and characterization on silicon integrated magnetics for high-frequency power applications. The presented device achieves superior characteristics in terms of energy density, electrical resistance, current capability, and inductance versus frequency stability. In order to demonstrate the effectiveness of use of the presented device for high-frequency power applications, it is tested with two different buck point of load (PoL) dc-dc converters, one of them is off-shelf chipset and the other is designed specifically for the microdevice. Experimental measurements show that the microdevices achieve a maximum inductance of about 50 nH, electrical resistance of 300 mΩ, rated current capabilities up to 1 A, and stable L versus f characteristics up to 100 MHz. Also, the PoL buck converters with the microdevices achieve a peak efficiency of up to 82% with a flat efficiency curve at switching frequencies up to 30 MHz while providing tight output voltage regulation (<0.2%) and low temperature rise (40 °C) at the rated current.

AB - This paper presents the design, fabrication, and characterization on silicon integrated magnetics for high-frequency power applications. The presented device achieves superior characteristics in terms of energy density, electrical resistance, current capability, and inductance versus frequency stability. In order to demonstrate the effectiveness of use of the presented device for high-frequency power applications, it is tested with two different buck point of load (PoL) dc-dc converters, one of them is off-shelf chipset and the other is designed specifically for the microdevice. Experimental measurements show that the microdevices achieve a maximum inductance of about 50 nH, electrical resistance of 300 mΩ, rated current capabilities up to 1 A, and stable L versus f characteristics up to 100 MHz. Also, the PoL buck converters with the microdevices achieve a peak efficiency of up to 82% with a flat efficiency curve at switching frequencies up to 30 MHz while providing tight output voltage regulation (<0.2%) and low temperature rise (40 °C) at the rated current.

KW - DC-DC converters

KW - high switching frequency

KW - magnetics on silicon

KW - microinductor

KW - microtransformer

KW - point of load (PoL)

KW - power conversion

KW - power transformer

KW - switched-mode power supply

UR - http://www.scopus.com/inward/record.url?scp=85071306554&partnerID=8YFLogxK

U2 - 10.1109/TIA.2019.2921523

DO - 10.1109/TIA.2019.2921523

M3 - Article

AN - SCOPUS:85071306554

VL - 55

SP - 5068

EP - 5077

JO - IEEE Transactions on Industry Applications

JF - IEEE Transactions on Industry Applications

SN - 0093-9994

IS - 5

M1 - 8732443

ER -

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