Methods of analysis for a deeper understanding of the grinding process

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Berend Denkena
  • Thilo Grove
  • Tim Göttsching
  • Patrick Dzierzawa
  • Fabian Kempf
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Details

Original languageEnglish
Title of host publicationProceedings of the 20th International Symposium on Advances in Abrasive Technology
Subtitle of host publication3-6 December, Okinawa, Japan
Pages945-951
Number of pages7
Publication statusPublished - 2017
Event20th International Symposium on Advances in Abrasive Technology, ISAAT 2017 - Okinawa, Japan
Duration: 3 Dec 20176 Dec 2017

Abstract

The design of grinding tools as well as the corresponding grinding process are complex compared to other tools and processes, making it difficult to correlate specific tool properties to individual process results. Suitable methods are required in order to gain a deeper understanding of the different influences of the grinding tool on specific aspects of the grinding process. This paper presents methods that were developed at the Institute of Production Engineering and Machine Tools to analyze the influences of the tool manufacturing process and tool preparation on the grinding behavior.

Keywords

    Analyzing methods, Chip formation, Grinding, Grinding tool properties

ASJC Scopus subject areas

Cite this

Methods of analysis for a deeper understanding of the grinding process. / Denkena, Berend; Grove, Thilo; Göttsching, Tim et al.
Proceedings of the 20th International Symposium on Advances in Abrasive Technology: 3-6 December, Okinawa, Japan. 2017. p. 945-951.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Denkena, B, Grove, T, Göttsching, T, Dzierzawa, P & Kempf, F 2017, Methods of analysis for a deeper understanding of the grinding process. in Proceedings of the 20th International Symposium on Advances in Abrasive Technology: 3-6 December, Okinawa, Japan. pp. 945-951, 20th International Symposium on Advances in Abrasive Technology, ISAAT 2017, Okinawa, Japan, 3 Dec 2017. <http://icat-isaat.org/static/ISAAT-2017/pdf/CH10_Grinding_Wheel/R419C000120_1.pdf>
Denkena, B., Grove, T., Göttsching, T., Dzierzawa, P., & Kempf, F. (2017). Methods of analysis for a deeper understanding of the grinding process. In Proceedings of the 20th International Symposium on Advances in Abrasive Technology: 3-6 December, Okinawa, Japan (pp. 945-951) http://icat-isaat.org/static/ISAAT-2017/pdf/CH10_Grinding_Wheel/R419C000120_1.pdf
Denkena B, Grove T, Göttsching T, Dzierzawa P, Kempf F. Methods of analysis for a deeper understanding of the grinding process. In Proceedings of the 20th International Symposium on Advances in Abrasive Technology: 3-6 December, Okinawa, Japan. 2017. p. 945-951
Denkena, Berend ; Grove, Thilo ; Göttsching, Tim et al. / Methods of analysis for a deeper understanding of the grinding process. Proceedings of the 20th International Symposium on Advances in Abrasive Technology: 3-6 December, Okinawa, Japan. 2017. pp. 945-951
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