Details
| Original language | English |
|---|---|
| Pages (from-to) | 347-355 |
| Number of pages | 9 |
| Journal | IEEE Transactions on Advanced Packaging |
| Volume | 25 |
| Issue number | 3 |
| Publication status | Published - Aug 2002 |
Abstract
Analysis and design of interconnects in high speed integrated circuits and systems involves models in the form of multiconductor transmission lines. The fundamental parameters of those models are matrices of capacitance, (C), inductance, (L), resistance, (JR), and conductance (G). In this paper we present a methodology for measurement of entries in capacitance matrix. The entries of capacitance matrices can be calculated using numerical solvers of electrostatic fields established under the assumption of suitable biasing of interconnect structures. Numerical calculations of complete field equations are very complex and expensive in terms of computer time therefore, several approximations are made in constructing interconnect dedicated software packages available on the market. Because of these approximations it is necessary to validate the calculations via measurements. Calculation the off-diagonal entries of capacitance matrix from measurements of "two-terminal" capacitances is strongly corrupted by the measuring errors. This paper presents a method for direct capacitance measurement in multi-conductor structures and provides analysis of accuracy. It is shown that using the described method the accuracy of determining Maxwell's matrix coefficients is the same as the measurement accuracy of the "two-terminal" capacitances.
Keywords
- Active separation, Error propagation, Interconnections in VLSI, Maxwell matrix, Multiconductor metal transmission lines
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
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In: IEEE Transactions on Advanced Packaging, Vol. 25, No. 3, 08.2002, p. 347-355.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Methodology for characterization of high-speed multi-conductor metal interconnections and evaluation of measurement errors
AU - Palusinski, Olgierd A.
AU - Znamirowski, Lech
AU - Reiss, Karl
AU - Grabinski, Hartmut
PY - 2002/8
Y1 - 2002/8
N2 - Analysis and design of interconnects in high speed integrated circuits and systems involves models in the form of multiconductor transmission lines. The fundamental parameters of those models are matrices of capacitance, (C), inductance, (L), resistance, (JR), and conductance (G). In this paper we present a methodology for measurement of entries in capacitance matrix. The entries of capacitance matrices can be calculated using numerical solvers of electrostatic fields established under the assumption of suitable biasing of interconnect structures. Numerical calculations of complete field equations are very complex and expensive in terms of computer time therefore, several approximations are made in constructing interconnect dedicated software packages available on the market. Because of these approximations it is necessary to validate the calculations via measurements. Calculation the off-diagonal entries of capacitance matrix from measurements of "two-terminal" capacitances is strongly corrupted by the measuring errors. This paper presents a method for direct capacitance measurement in multi-conductor structures and provides analysis of accuracy. It is shown that using the described method the accuracy of determining Maxwell's matrix coefficients is the same as the measurement accuracy of the "two-terminal" capacitances.
AB - Analysis and design of interconnects in high speed integrated circuits and systems involves models in the form of multiconductor transmission lines. The fundamental parameters of those models are matrices of capacitance, (C), inductance, (L), resistance, (JR), and conductance (G). In this paper we present a methodology for measurement of entries in capacitance matrix. The entries of capacitance matrices can be calculated using numerical solvers of electrostatic fields established under the assumption of suitable biasing of interconnect structures. Numerical calculations of complete field equations are very complex and expensive in terms of computer time therefore, several approximations are made in constructing interconnect dedicated software packages available on the market. Because of these approximations it is necessary to validate the calculations via measurements. Calculation the off-diagonal entries of capacitance matrix from measurements of "two-terminal" capacitances is strongly corrupted by the measuring errors. This paper presents a method for direct capacitance measurement in multi-conductor structures and provides analysis of accuracy. It is shown that using the described method the accuracy of determining Maxwell's matrix coefficients is the same as the measurement accuracy of the "two-terminal" capacitances.
KW - Active separation
KW - Error propagation
KW - Interconnections in VLSI
KW - Maxwell matrix
KW - Multiconductor metal transmission lines
UR - http://www.scopus.com/inward/record.url?scp=0036706227&partnerID=8YFLogxK
U2 - 10.1109/TADVP.2002.806740
DO - 10.1109/TADVP.2002.806740
M3 - Article
AN - SCOPUS:0036706227
VL - 25
SP - 347
EP - 355
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
SN - 1521-3323
IS - 3
ER -