Details
| Original language | English |
|---|---|
| Pages (from-to) | 367-374 |
| Number of pages | 8 |
| Journal | Metallography, Microstructure, and Analysis |
| Volume | 6 |
| Issue number | 5 |
| Publication status | Published - 1 Oct 2017 |
Abstract
In the present study, a semi-automated method for the measurement of intermetallic compound layer thicknesses is introduced. Based on backscattered electron contrast images of the bond zones that feature a sufficient contrast between the substrates and the intermetallic compound layer, every line of pixels perpendicular to the bond zone is analyzed. This provides the opportunity to evaluate the distribution of the measured single thicknesses to describe the layer morphology quantitatively. It is shown that it is possible to identify several morphological features by employing certain statistical values. Commonly used measurement methods are compared to the results of the proposed method to show its applicability.
Keywords
- Intermetallic compound layer (20MnCr5, AW6082), Numerical computing environment, SEM, Thickness measurement
ASJC Scopus subject areas
- Materials Science(all)
- Metals and Alloys
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In: Metallography, Microstructure, and Analysis, Vol. 6, No. 5, 01.10.2017, p. 367-374.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Method for Semi-Automated Measurement and Statistical Evaluation of Iron Aluminum Intermetallic Compound Layer Thickness and Morphology
AU - Herbst, Sebastian
AU - Dovletoglou, Christopher Neal
AU - Nürnberger, Florian
N1 - Funding information: Acknowledgments The results presented in this paper were obtained within the Collaborative Research Centre 1153 ‘‘Process chain to produce hybrid high performance components by Tailored Forming’’ within the subproject A2. The authors thank the German Research Foundation (DFG) for the financial and organizational support of this project.
PY - 2017/10/1
Y1 - 2017/10/1
N2 - In the present study, a semi-automated method for the measurement of intermetallic compound layer thicknesses is introduced. Based on backscattered electron contrast images of the bond zones that feature a sufficient contrast between the substrates and the intermetallic compound layer, every line of pixels perpendicular to the bond zone is analyzed. This provides the opportunity to evaluate the distribution of the measured single thicknesses to describe the layer morphology quantitatively. It is shown that it is possible to identify several morphological features by employing certain statistical values. Commonly used measurement methods are compared to the results of the proposed method to show its applicability.
AB - In the present study, a semi-automated method for the measurement of intermetallic compound layer thicknesses is introduced. Based on backscattered electron contrast images of the bond zones that feature a sufficient contrast between the substrates and the intermetallic compound layer, every line of pixels perpendicular to the bond zone is analyzed. This provides the opportunity to evaluate the distribution of the measured single thicknesses to describe the layer morphology quantitatively. It is shown that it is possible to identify several morphological features by employing certain statistical values. Commonly used measurement methods are compared to the results of the proposed method to show its applicability.
KW - Intermetallic compound layer (20MnCr5, AW6082)
KW - Numerical computing environment
KW - SEM
KW - Thickness measurement
UR - http://www.scopus.com/inward/record.url?scp=85030753828&partnerID=8YFLogxK
U2 - 10.1007/s13632-017-0378-1
DO - 10.1007/s13632-017-0378-1
M3 - Article
AN - SCOPUS:85030753828
VL - 6
SP - 367
EP - 374
JO - Metallography, Microstructure, and Analysis
JF - Metallography, Microstructure, and Analysis
SN - 2192-9262
IS - 5
ER -