Details
| Original language | English |
|---|---|
| Title of host publication | IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits |
| Publication status | Published - 2010 |
| Event | 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010 - Singapore, Singapore Duration: 5 Jul 2010 → 9 Jul 2010 |
Publication series
| Name | Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA |
|---|
Abstract
The influence of the via bottom geometry on stress development in Cu interconnects is investigated by FE-Simulation. The mechanical characterization shows the weakest link concerning the reliability of the different via geometries. The via with the cone-shaped bottom seems to have the best reliability with respect to mechanical stress.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
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IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits. 2010. 5532227 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Mechanical characterization of copper based metallizations with different via-bottom geometries
AU - Ciptokusumo, Johar
AU - Weide-Zaage, Kirsten
AU - Aubel, Oliver
N1 - Copyright: Copyright 2010 Elsevier B.V., All rights reserved.
PY - 2010
Y1 - 2010
N2 - The influence of the via bottom geometry on stress development in Cu interconnects is investigated by FE-Simulation. The mechanical characterization shows the weakest link concerning the reliability of the different via geometries. The via with the cone-shaped bottom seems to have the best reliability with respect to mechanical stress.
AB - The influence of the via bottom geometry on stress development in Cu interconnects is investigated by FE-Simulation. The mechanical characterization shows the weakest link concerning the reliability of the different via geometries. The via with the cone-shaped bottom seems to have the best reliability with respect to mechanical stress.
UR - http://www.scopus.com/inward/record.url?scp=77956422312&partnerID=8YFLogxK
U2 - 10.1109/IPFA.2010.5532227
DO - 10.1109/IPFA.2010.5532227
M3 - Conference contribution
AN - SCOPUS:77956422312
SN - 9781424455973
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
BT - IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits
T2 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010
Y2 - 5 July 2010 through 9 July 2010
ER -