Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 2172-2177 |
| Number of pages | 6 |
| ISBN (electronic) | 9798350375985 |
| Publication status | Published - 2024 |
| Event | 74th IEEE Electronic Components and Technology Conference, ECTC 2024 - Denver, United States Duration: 28 May 2024 → 31 May 2024 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| ISSN (Print) | 0569-5503 |
Abstract
The increase in battery-powered handheld devices is driving the demand for faster charging converters. Gallium Nitride (GaN) converters allow frequencies of above 500 kHz, enabling a smaller footprint especially for magnetic components. In this paper molded interconnect device (MID) transformers with a height of 2.5 mm are produced via a two-step injection molding process using polyether ether ketone (PEEK) granulate. The two- step injection molding process encapsulates a water jet-cut ferrite core. Laser Direct Structuring (LDS) creates the coils around the core. This process produces multiple transformers in two designs with inductance values around 19 μH and 28 μH, each boasting a high coupling coefficient exceeding 95 %. CT images reveal cracks in the ferrite core after the second injection molding step, explaining discrepancies between measured and simulated results. Nevertheless, MID transformers can skip the complex process of winding and are already packed, which can lower the cost for an industrial production.
Keywords
- embedding core, inductance, Laser Direct Structuring, LDS, MID, Molded Interconnect Device, PEEK, planar magnetics, Plastic, transformer
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., 2024. p. 2172-2177 (Proceedings - Electronic Components and Technology Conference).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Manufacturing and Characterization of Planar Transformers as Molded Interconnect Device Technology Component for an Industrial Production
AU - Bierwirth, Tim Nils
AU - Bengsch, Sebastian
AU - Werner, Michael
AU - Wachs, Rico
AU - Henne, Christian
AU - Bur, Stefan
AU - Dencker, Folke
AU - Wurz, Marc Christopher
N1 - Publisher Copyright: © 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - The increase in battery-powered handheld devices is driving the demand for faster charging converters. Gallium Nitride (GaN) converters allow frequencies of above 500 kHz, enabling a smaller footprint especially for magnetic components. In this paper molded interconnect device (MID) transformers with a height of 2.5 mm are produced via a two-step injection molding process using polyether ether ketone (PEEK) granulate. The two- step injection molding process encapsulates a water jet-cut ferrite core. Laser Direct Structuring (LDS) creates the coils around the core. This process produces multiple transformers in two designs with inductance values around 19 μH and 28 μH, each boasting a high coupling coefficient exceeding 95 %. CT images reveal cracks in the ferrite core after the second injection molding step, explaining discrepancies between measured and simulated results. Nevertheless, MID transformers can skip the complex process of winding and are already packed, which can lower the cost for an industrial production.
AB - The increase in battery-powered handheld devices is driving the demand for faster charging converters. Gallium Nitride (GaN) converters allow frequencies of above 500 kHz, enabling a smaller footprint especially for magnetic components. In this paper molded interconnect device (MID) transformers with a height of 2.5 mm are produced via a two-step injection molding process using polyether ether ketone (PEEK) granulate. The two- step injection molding process encapsulates a water jet-cut ferrite core. Laser Direct Structuring (LDS) creates the coils around the core. This process produces multiple transformers in two designs with inductance values around 19 μH and 28 μH, each boasting a high coupling coefficient exceeding 95 %. CT images reveal cracks in the ferrite core after the second injection molding step, explaining discrepancies between measured and simulated results. Nevertheless, MID transformers can skip the complex process of winding and are already packed, which can lower the cost for an industrial production.
KW - embedding core
KW - inductance
KW - Laser Direct Structuring
KW - LDS
KW - MID
KW - Molded Interconnect Device
KW - PEEK
KW - planar magnetics
KW - Plastic
KW - transformer
UR - http://www.scopus.com/inward/record.url?scp=85197732880&partnerID=8YFLogxK
U2 - 10.1109/ECTC51529.2024.00370
DO - 10.1109/ECTC51529.2024.00370
M3 - Conference contribution
AN - SCOPUS:85197732880
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2172
EP - 2177
BT - Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 74th IEEE Electronic Components and Technology Conference, ECTC 2024
Y2 - 28 May 2024 through 31 May 2024
ER -