Details
| Original language | English |
|---|---|
| Title of host publication | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
| Publisher | VDE Verlag GmbH |
| Pages | 672-675 |
| Number of pages | 4 |
| ISBN (electronic) | 9783800762040 |
| Publication status | Published - 2023 |
| Event | Technology Congress 2023: Microelectronics, Microsystems Technology and their Applications - Sustainability and Technology Sovereignty - Dresden, Germany Duration: 23 Oct 2023 → 25 Oct 2023 |
Abstract
High operating temperatures are omnipresent in the production engineering environment. In order to achieve optimum production results, measurements of the temperature are carried out in most production processes. In this research, an integration concept, a temperature field simulation for positioning and a process chain for the production of a sensor insert in the forming zone of an extrusion die was developed. Subsequently, the application behavior and the applicability in the process were evaluated. It was shown that the insert could withstand the forces during extrusion and had no effect on the end product. In addition, a friction-induced temperature increases of 110 °C was observed during the extrusion process. There is a good agreement between the simulative prediction and the experimental results.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Materials Science(all)
- Surfaces, Coatings and Films
- Physics and Astronomy(all)
- Condensed Matter Physics
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
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MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. p. 672-675.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Manufacture and application of a sensor inlet for high-temperature measurements in the frictional zone of an extrusion die
AU - Raumel, Selina
AU - Moradi, Amirreza
AU - Wurz, Marc C.
N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023
Y1 - 2023
N2 - High operating temperatures are omnipresent in the production engineering environment. In order to achieve optimum production results, measurements of the temperature are carried out in most production processes. In this research, an integration concept, a temperature field simulation for positioning and a process chain for the production of a sensor insert in the forming zone of an extrusion die was developed. Subsequently, the application behavior and the applicability in the process were evaluated. It was shown that the insert could withstand the forces during extrusion and had no effect on the end product. In addition, a friction-induced temperature increases of 110 °C was observed during the extrusion process. There is a good agreement between the simulative prediction and the experimental results.
AB - High operating temperatures are omnipresent in the production engineering environment. In order to achieve optimum production results, measurements of the temperature are carried out in most production processes. In this research, an integration concept, a temperature field simulation for positioning and a process chain for the production of a sensor insert in the forming zone of an extrusion die was developed. Subsequently, the application behavior and the applicability in the process were evaluated. It was shown that the insert could withstand the forces during extrusion and had no effect on the end product. In addition, a friction-induced temperature increases of 110 °C was observed during the extrusion process. There is a good agreement between the simulative prediction and the experimental results.
UR - http://www.scopus.com/inward/record.url?scp=85196915523&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196915523
SP - 672
EP - 675
BT - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
PB - VDE Verlag GmbH
T2 - Technology Congress 2023
Y2 - 23 October 2023 through 25 October 2023
ER -