Details
| Original language | English |
|---|---|
| Pages (from-to) | 216-224 |
| Number of pages | 9 |
| Journal | CARBON |
| Volume | 165 |
| Early online date | 24 Apr 2020 |
| Publication status | Published - 15 Sept 2020 |
Abstract
To ensure reliable performance and lifetime of electronics, effective and efficient heat removal is essential, which relies heavily on the high thermal conductivity of the packaging substrates and thermal interface materials (TIMs). Highly conductive fillers have been commonly applied to enhance the thermal conductivity of TIMs, while the enhancement effect has been significantly impeded by the interfacial thermal resistance. This work reveals that the new type of ultra-thin carbon nanomaterial – carbon nanothreads, possess a much smaller interfacial thermal resistance (3.1 ± 0.4 × 10−9 Km2/W) between each other compared with that of the (4,0) carbon nanotubes (8.8 ± 4.6 × 10−9 Km2/W). Similar as found for carbon nanotubes, the interfacial thermal resistance decreases when the interfacial crossing angle decreases or the contact area increases. Surprisingly, both compressive and stretching interfacial distance are found to enhance the interfacial thermal conductance. It is found that different carbon nanothreads exhibit an interfacial thermal conductance between 60 and 110 pW/K, which can be remarkably enhanced by introducing interfacial cross-linkers. Combining with the ultra-thin nature of carbon nanothreads, our work suggests that carbon nanothreads can be an excellent alternative nanofillers for polymer composites with enhanced thermal conductivity.
Keywords
- Carbon nanothread, Carbon nanotube, Density of states, Kapitza resistance, Molecular dynamics simulation
ASJC Scopus subject areas
- Chemistry(all)
- General Chemistry
- Materials Science(all)
- General Materials Science
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In: CARBON, Vol. 165, 15.09.2020, p. 216-224.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Low interfacial thermal resistance between crossed ultra-thin carbon nanothreads
AU - Zhan, Haifei
AU - Zhang, Gang
AU - Zhuang, Xiaoying
AU - Timon, Rabczuk
AU - Gu, Yuantong
N1 - Funding Information: Support from the ARC Discovery Project ( DP170102861 ) and the High-Performance Computing (HPC) resources provided by the Queensland University of Technology (QUT) are gratefully acknowledged (HZ, YG, JB). This research was undertaken with the assistance of resource and services from Intersect Australia Ltd, and the National Computational Infrastructure (NCI) , which is supported by Australian Government . HZ would also like to acknowledge the support from the Start-up Fund from Queensland University of Technology .
PY - 2020/9/15
Y1 - 2020/9/15
N2 - To ensure reliable performance and lifetime of electronics, effective and efficient heat removal is essential, which relies heavily on the high thermal conductivity of the packaging substrates and thermal interface materials (TIMs). Highly conductive fillers have been commonly applied to enhance the thermal conductivity of TIMs, while the enhancement effect has been significantly impeded by the interfacial thermal resistance. This work reveals that the new type of ultra-thin carbon nanomaterial – carbon nanothreads, possess a much smaller interfacial thermal resistance (3.1 ± 0.4 × 10−9 Km2/W) between each other compared with that of the (4,0) carbon nanotubes (8.8 ± 4.6 × 10−9 Km2/W). Similar as found for carbon nanotubes, the interfacial thermal resistance decreases when the interfacial crossing angle decreases or the contact area increases. Surprisingly, both compressive and stretching interfacial distance are found to enhance the interfacial thermal conductance. It is found that different carbon nanothreads exhibit an interfacial thermal conductance between 60 and 110 pW/K, which can be remarkably enhanced by introducing interfacial cross-linkers. Combining with the ultra-thin nature of carbon nanothreads, our work suggests that carbon nanothreads can be an excellent alternative nanofillers for polymer composites with enhanced thermal conductivity.
AB - To ensure reliable performance and lifetime of electronics, effective and efficient heat removal is essential, which relies heavily on the high thermal conductivity of the packaging substrates and thermal interface materials (TIMs). Highly conductive fillers have been commonly applied to enhance the thermal conductivity of TIMs, while the enhancement effect has been significantly impeded by the interfacial thermal resistance. This work reveals that the new type of ultra-thin carbon nanomaterial – carbon nanothreads, possess a much smaller interfacial thermal resistance (3.1 ± 0.4 × 10−9 Km2/W) between each other compared with that of the (4,0) carbon nanotubes (8.8 ± 4.6 × 10−9 Km2/W). Similar as found for carbon nanotubes, the interfacial thermal resistance decreases when the interfacial crossing angle decreases or the contact area increases. Surprisingly, both compressive and stretching interfacial distance are found to enhance the interfacial thermal conductance. It is found that different carbon nanothreads exhibit an interfacial thermal conductance between 60 and 110 pW/K, which can be remarkably enhanced by introducing interfacial cross-linkers. Combining with the ultra-thin nature of carbon nanothreads, our work suggests that carbon nanothreads can be an excellent alternative nanofillers for polymer composites with enhanced thermal conductivity.
KW - Carbon nanothread
KW - Carbon nanotube
KW - Density of states
KW - Kapitza resistance
KW - Molecular dynamics simulation
UR - http://www.scopus.com/inward/record.url?scp=85084079210&partnerID=8YFLogxK
U2 - 10.1016/j.carbon.2020.04.065
DO - 10.1016/j.carbon.2020.04.065
M3 - Article
AN - SCOPUS:85084079210
VL - 165
SP - 216
EP - 224
JO - CARBON
JF - CARBON
SN - 0008-6223
ER -