Details
Original language | English |
---|---|
Pages (from-to) | 2698-2700 |
Number of pages | 3 |
Journal | Solar Energy Materials and Solar Cells |
Volume | 95 |
Issue number | 9 |
Early online date | 3 Jun 2011 |
Publication status | Published - Sept 2011 |
Externally published | Yes |
Abstract
We demonstrate damage free selective laser ablation of silicon nitride from a silicon nitride/amorphous silicon double layer. This approach allows local contact formation to passivated silicon. Thereby the remaining amorphous silicon dissolves in evaporated aluminum by annealing. This technique is especially useful for contacting thin emitters since it avoids any damage to the silicon substrate. We demonstrate a local contact resistivity of 0.8±0.3 mΩ cm2 on a phosphorous diffused emitter with a peak doping density of 2×1020 cm-3. Laser treated as well as non-treated areas show the same carrier lifetime of 2000 μs on 100 Ω cm mono-crystalline silicon, proving the selective ablation.
Keywords
- Amorphous silicon passivation, Local contact openings, Selective laser ablation, Ultraviolet pico second laser
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Energy(all)
- Renewable Energy, Sustainability and the Environment
- Materials Science(all)
- Surfaces, Coatings and Films
Sustainable Development Goals
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In: Solar Energy Materials and Solar Cells, Vol. 95, No. 9, 09.2011, p. 2698-2700.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Local aluminum-silicon contacts by layer selective laser ablation
AU - Haase, F.
AU - Neubert, T.
AU - Horbelt, R.
AU - Terheiden, B.
AU - Bothe, K.
AU - Brendel, R.
PY - 2011/9
Y1 - 2011/9
N2 - We demonstrate damage free selective laser ablation of silicon nitride from a silicon nitride/amorphous silicon double layer. This approach allows local contact formation to passivated silicon. Thereby the remaining amorphous silicon dissolves in evaporated aluminum by annealing. This technique is especially useful for contacting thin emitters since it avoids any damage to the silicon substrate. We demonstrate a local contact resistivity of 0.8±0.3 mΩ cm2 on a phosphorous diffused emitter with a peak doping density of 2×1020 cm-3. Laser treated as well as non-treated areas show the same carrier lifetime of 2000 μs on 100 Ω cm mono-crystalline silicon, proving the selective ablation.
AB - We demonstrate damage free selective laser ablation of silicon nitride from a silicon nitride/amorphous silicon double layer. This approach allows local contact formation to passivated silicon. Thereby the remaining amorphous silicon dissolves in evaporated aluminum by annealing. This technique is especially useful for contacting thin emitters since it avoids any damage to the silicon substrate. We demonstrate a local contact resistivity of 0.8±0.3 mΩ cm2 on a phosphorous diffused emitter with a peak doping density of 2×1020 cm-3. Laser treated as well as non-treated areas show the same carrier lifetime of 2000 μs on 100 Ω cm mono-crystalline silicon, proving the selective ablation.
KW - Amorphous silicon passivation
KW - Local contact openings
KW - Selective laser ablation
KW - Ultraviolet pico second laser
UR - http://www.scopus.com/inward/record.url?scp=79959297320&partnerID=8YFLogxK
U2 - 10.1016/j.solmat.2011.05.015
DO - 10.1016/j.solmat.2011.05.015
M3 - Article
AN - SCOPUS:79959297320
VL - 95
SP - 2698
EP - 2700
JO - Solar Energy Materials and Solar Cells
JF - Solar Energy Materials and Solar Cells
SN - 0927-0248
IS - 9
ER -