Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI |
| Pages | 115-118 |
| Number of pages | 4 |
| Publication status | Published - 2002 |
| Event | 6th IEEE Workshop on Signal Propagation on Interconnects, SPI - Pisa, Italy Duration: 12 May 2002 → 15 May 2002 |
Publication series
| Name | Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI |
|---|
Abstract
In this paper we investigate the crosstalk influence of interconnects on test patterns in integrated circuits in today and future technologies. The test patterns are produced by a linear feedback shift register (LFSR). We show the per unit length line parameters L', C' and R' of interconnects in 150 nm down to 35 nm technologies wherefore we assume the smallest geometries predicted by the SIA roadmap. Using these parameters we demonstrate that crosstalk influences the signal behaviour depending on the technology used. The test patterns were generated by a 5 bit LFSR using an interconnect system with a length of 1 mm in these future technologies.
ASJC Scopus subject areas
- Computer Science(all)
- Signal Processing
- Computer Science(all)
- Computer Networks and Communications
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Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI. 2002. p. 115-118 4027673 (Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - LFSR test pattern crosstalk in nanometer technologies
AU - Treytnar, Dieter
AU - Redeker, Michael
AU - Grabinski, Hartmut
AU - Ktata, Faïez M.
PY - 2002
Y1 - 2002
N2 - In this paper we investigate the crosstalk influence of interconnects on test patterns in integrated circuits in today and future technologies. The test patterns are produced by a linear feedback shift register (LFSR). We show the per unit length line parameters L', C' and R' of interconnects in 150 nm down to 35 nm technologies wherefore we assume the smallest geometries predicted by the SIA roadmap. Using these parameters we demonstrate that crosstalk influences the signal behaviour depending on the technology used. The test patterns were generated by a 5 bit LFSR using an interconnect system with a length of 1 mm in these future technologies.
AB - In this paper we investigate the crosstalk influence of interconnects on test patterns in integrated circuits in today and future technologies. The test patterns are produced by a linear feedback shift register (LFSR). We show the per unit length line parameters L', C' and R' of interconnects in 150 nm down to 35 nm technologies wherefore we assume the smallest geometries predicted by the SIA roadmap. Using these parameters we demonstrate that crosstalk influences the signal behaviour depending on the technology used. The test patterns were generated by a 5 bit LFSR using an interconnect system with a length of 1 mm in these future technologies.
UR - http://www.scopus.com/inward/record.url?scp=46649094602&partnerID=8YFLogxK
U2 - 10.1109/SPI.2002.258315
DO - 10.1109/SPI.2002.258315
M3 - Conference contribution
AN - SCOPUS:46649094602
SN - 0780398211
SN - 9780780398214
T3 - Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
SP - 115
EP - 118
BT - Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
T2 - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
Y2 - 12 May 2002 through 15 May 2002
ER -