Details
| Original language | English |
|---|---|
| Title of host publication | International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017 |
| Editors | Thomas Otto |
| Pages | 399-402 |
| Number of pages | 4 |
| ISBN (electronic) | 9783957350572 |
| Publication status | Published - 2017 |
| Event | International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017 - Cork, Ireland Duration: 8 Mar 2017 → 9 Mar 2017 |
Publication series
| Name | International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017 |
|---|
ASJC Scopus subject areas
- Computer Science(all)
- Computer Science Applications
- Computer Science(all)
- Artificial Intelligence
- Computer Science(all)
- Computer Networks and Communications
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International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017. ed. / Thomas Otto. 2017. p. 399-402 (International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - LED packaging with optimized heat dissipation for a micro LED array
AU - Kusch, Alexander
AU - Wurz, Marc
AU - Held, Marcel P.
AU - Wolf, Alexander
AU - Lachmayer, Roland
PY - 2017
Y1 - 2017
UR - http://www.scopus.com/inward/record.url?scp=85032297199&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85032297199
T3 - International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
SP - 399
EP - 402
BT - International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
A2 - Otto, Thomas
T2 - International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
Y2 - 8 March 2017 through 9 March 2017
ER -