Details
| Original language | English |
|---|---|
| Title of host publication | 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019 |
| Subtitle of host publication | Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (electronic) | 978-1-5386-8040-7 |
| ISBN (print) | 978-1-5386-8041-4 |
| Publication status | Published - Mar 2019 |
| Event | 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019 - Hannover, Germany Duration: 24 Mar 2019 → 27 Mar 2019 |
Abstract
The reliability of CMOS circuits is influenced by local inhomogeneities in current density, temperature and mechanical stress. Mechanical stress caused by processing and post-processing sources like material mismatch, temperature steps and extrinsic sources like bonding, 3D integration and extended operating conditions becomes more and more relevant the for reliability. It can affect the life time performance of interconnects as well as the function of active devices like stress sensitive transistors.First simulations which support the development work for optimized interconnect layouts as features to improve the reliability of a circuit were prepared. The evaluations started with the heater development of self-heating test structures for higher metal layers for accelerated reliability tests. It continued with the development of a high robust metal stack. The simulations and the tests at heaters and high robust metallization test structures demonstrated the advantages of such a layout improvement.The simulations of the distribution of the temperature and the mechanical stress illustrates the important parameters and their interactions.The paper presents new ANSYS® -simulations on some exemplary heater layout variants in the highly robust metallization design. The scientific questions were the suitability and the benefits of such a heater layout for heating, cooling and stress distribution in CMOS circuits. Different heater-test line models have been analysed by ANSYS® -simulations. The variants of the models were forced or no forced current in heater and/or test line and the kind of metal layer of heater connection. The current density, temperature, their gradients, the hydrostatic stress, the Von Mises stress and the mass flux divergences have been analysed.Such simulations can be utilized to improve parts of circuits like chip corners, sensitive transistors, circuits on GaN-substrate, with TSVs or applications with 3D integration. The local temperature and stress management can be improved by the special metallization layout and the improvement can be supported by simulation data.
Keywords
- Improved reliability, Mass flux simulation, Robust interconnect, Self-heating test structure, Stress distribution
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Chemical Engineering(all)
- Fluid Flow and Transfer Processes
- Engineering(all)
- Electrical and Electronic Engineering
- Engineering(all)
- Mechanical Engineering
- Engineering(all)
- Safety, Risk, Reliability and Quality
- Mathematics(all)
- Modelling and Simulation
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2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724562.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution
AU - Hein, Verena
AU - Weide-Zaage, Kirsten
AU - Yang, Xi
PY - 2019/3
Y1 - 2019/3
N2 - The reliability of CMOS circuits is influenced by local inhomogeneities in current density, temperature and mechanical stress. Mechanical stress caused by processing and post-processing sources like material mismatch, temperature steps and extrinsic sources like bonding, 3D integration and extended operating conditions becomes more and more relevant the for reliability. It can affect the life time performance of interconnects as well as the function of active devices like stress sensitive transistors.First simulations which support the development work for optimized interconnect layouts as features to improve the reliability of a circuit were prepared. The evaluations started with the heater development of self-heating test structures for higher metal layers for accelerated reliability tests. It continued with the development of a high robust metal stack. The simulations and the tests at heaters and high robust metallization test structures demonstrated the advantages of such a layout improvement.The simulations of the distribution of the temperature and the mechanical stress illustrates the important parameters and their interactions.The paper presents new ANSYS® -simulations on some exemplary heater layout variants in the highly robust metallization design. The scientific questions were the suitability and the benefits of such a heater layout for heating, cooling and stress distribution in CMOS circuits. Different heater-test line models have been analysed by ANSYS® -simulations. The variants of the models were forced or no forced current in heater and/or test line and the kind of metal layer of heater connection. The current density, temperature, their gradients, the hydrostatic stress, the Von Mises stress and the mass flux divergences have been analysed.Such simulations can be utilized to improve parts of circuits like chip corners, sensitive transistors, circuits on GaN-substrate, with TSVs or applications with 3D integration. The local temperature and stress management can be improved by the special metallization layout and the improvement can be supported by simulation data.
AB - The reliability of CMOS circuits is influenced by local inhomogeneities in current density, temperature and mechanical stress. Mechanical stress caused by processing and post-processing sources like material mismatch, temperature steps and extrinsic sources like bonding, 3D integration and extended operating conditions becomes more and more relevant the for reliability. It can affect the life time performance of interconnects as well as the function of active devices like stress sensitive transistors.First simulations which support the development work for optimized interconnect layouts as features to improve the reliability of a circuit were prepared. The evaluations started with the heater development of self-heating test structures for higher metal layers for accelerated reliability tests. It continued with the development of a high robust metal stack. The simulations and the tests at heaters and high robust metallization test structures demonstrated the advantages of such a layout improvement.The simulations of the distribution of the temperature and the mechanical stress illustrates the important parameters and their interactions.The paper presents new ANSYS® -simulations on some exemplary heater layout variants in the highly robust metallization design. The scientific questions were the suitability and the benefits of such a heater layout for heating, cooling and stress distribution in CMOS circuits. Different heater-test line models have been analysed by ANSYS® -simulations. The variants of the models were forced or no forced current in heater and/or test line and the kind of metal layer of heater connection. The current density, temperature, their gradients, the hydrostatic stress, the Von Mises stress and the mass flux divergences have been analysed.Such simulations can be utilized to improve parts of circuits like chip corners, sensitive transistors, circuits on GaN-substrate, with TSVs or applications with 3D integration. The local temperature and stress management can be improved by the special metallization layout and the improvement can be supported by simulation data.
KW - Improved reliability
KW - Mass flux simulation
KW - Robust interconnect
KW - Self-heating test structure
KW - Stress distribution
UR - http://www.scopus.com/inward/record.url?scp=85067524478&partnerID=8YFLogxK
U2 - 10.1109/eurosime.2019.8724562
DO - 10.1109/eurosime.2019.8724562
M3 - Conference contribution
AN - SCOPUS:85067524478
SN - 978-1-5386-8041-4
BT - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Y2 - 24 March 2019 through 27 March 2019
ER -