Details
| Original language | English |
|---|---|
| Article number | 042030 |
| Journal | Journal of laser applications |
| Volume | 33 |
| Issue number | 4 |
| Early online date | 19 Oct 2021 |
| Publication status | Published - 1 Nov 2021 |
| Event | International Congress of Applications of Lasers and Electro-Optics 2021 - Online Duration: 18 Oct 2021 → 20 Oct 2021 Conference number: 40 |
Abstract
Fabrication technologies for the semiconductor industry have enabled ever smaller electronic components but now face a fundamental limit in their assembly. As the components get smaller and smaller, the difficulty of assembly increases. At the same time, the number of components per circuit board area is growing, as is the case with LED displays. This in turn calls for an increasing assembly rate. The conventional pick-and-place method can handle approximately 25-30 thousand dies per hour but has increasing limitations when component dimensions are reduced below 150 μm edge length. Laser-induced forward transfer is used as a potential alternative for an assembly of semiconductor components. This technique allows to transfer semiconductor components with an edge length of less than 150 μm to a target substrate. The current process is contactless, damage-free, and has sufficient placement accuracy. If this process is combined with the property of high-pulse repetition rates, it is possible to significantly increase the assembly rate of semiconductor components compared to the current limitations. The aim of this study is to characterize the flight properties of silicon semiconductor components of various dimensions in a laser-driven transfer process using optical imaging methods. This method allows to analyze velocity, the direction of fall, and acceleration of falling components. The results can be used to analyze the transfer behavior of various component sizes and to make estimates of the stability of the transfer process.
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
- Engineering(all)
- Biomedical Engineering
- Physics and Astronomy(all)
- Instrumentation
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In: Journal of laser applications, Vol. 33, No. 4, 042030, 01.11.2021.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Laser-induced forward transfer as a potential alternative to pick-and-place technology when assembling semiconductor components
AU - Springer, Matthias
AU - Düsing, Jan
AU - Koch, Jürgen
AU - Jäschke, Peter
AU - Kaierle, Stefan
AU - Overmeyer, Ludger
N1 - Conference code: 40
PY - 2021/11/1
Y1 - 2021/11/1
N2 - Fabrication technologies for the semiconductor industry have enabled ever smaller electronic components but now face a fundamental limit in their assembly. As the components get smaller and smaller, the difficulty of assembly increases. At the same time, the number of components per circuit board area is growing, as is the case with LED displays. This in turn calls for an increasing assembly rate. The conventional pick-and-place method can handle approximately 25-30 thousand dies per hour but has increasing limitations when component dimensions are reduced below 150 μm edge length. Laser-induced forward transfer is used as a potential alternative for an assembly of semiconductor components. This technique allows to transfer semiconductor components with an edge length of less than 150 μm to a target substrate. The current process is contactless, damage-free, and has sufficient placement accuracy. If this process is combined with the property of high-pulse repetition rates, it is possible to significantly increase the assembly rate of semiconductor components compared to the current limitations. The aim of this study is to characterize the flight properties of silicon semiconductor components of various dimensions in a laser-driven transfer process using optical imaging methods. This method allows to analyze velocity, the direction of fall, and acceleration of falling components. The results can be used to analyze the transfer behavior of various component sizes and to make estimates of the stability of the transfer process.
AB - Fabrication technologies for the semiconductor industry have enabled ever smaller electronic components but now face a fundamental limit in their assembly. As the components get smaller and smaller, the difficulty of assembly increases. At the same time, the number of components per circuit board area is growing, as is the case with LED displays. This in turn calls for an increasing assembly rate. The conventional pick-and-place method can handle approximately 25-30 thousand dies per hour but has increasing limitations when component dimensions are reduced below 150 μm edge length. Laser-induced forward transfer is used as a potential alternative for an assembly of semiconductor components. This technique allows to transfer semiconductor components with an edge length of less than 150 μm to a target substrate. The current process is contactless, damage-free, and has sufficient placement accuracy. If this process is combined with the property of high-pulse repetition rates, it is possible to significantly increase the assembly rate of semiconductor components compared to the current limitations. The aim of this study is to characterize the flight properties of silicon semiconductor components of various dimensions in a laser-driven transfer process using optical imaging methods. This method allows to analyze velocity, the direction of fall, and acceleration of falling components. The results can be used to analyze the transfer behavior of various component sizes and to make estimates of the stability of the transfer process.
UR - http://www.scopus.com/inward/record.url?scp=85117457463&partnerID=8YFLogxK
U2 - 10.2351/7.0000525
DO - 10.2351/7.0000525
M3 - Article
AN - SCOPUS:85117457463
VL - 33
JO - Journal of laser applications
JF - Journal of laser applications
SN - 1042-346X
IS - 4
M1 - 042030
T2 - International Congress of Applications of Lasers and Electro-Optics 2021
Y2 - 18 October 2021 through 20 October 2021
ER -