Details
| Translated title of the contribution | Lasergestütztes Bonden zwischen Silizium und Glas zur Herstellung von hermetischen Packages |
|---|---|
| Original language | English |
| Title of host publication | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
| Pages | 332-335 |
| Number of pages | 4 |
| ISBN (electronic) | 9783800762040 |
| Publication status | Published - 24 Oct 2023 |
Abstract
Keywords
- Packages, Laser assisted bonding, silicon-glass
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Condensed Matter Physics
- Materials Science(all)
- Surfaces, Coatings and Films
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
- Engineering(all)
- Electrical and Electronic Engineering
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MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. 2023. p. 332-335.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Laser-assisted bonding between silicon and glass for the production of hermetic packages
AU - Koch, Jannik
N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023/10/24
Y1 - 2023/10/24
N2 - Hermetic packages fabricated using silicon microtechnology are important for the actual miniaturisation of quantum sensors, which will provide high accuracy and sensitivity for future industrial systems. For this purpose, bonding between silicon and glass with a UV marking laser is investigated. Compared to other hermetic bonding methods, laser bonding allows a lower global temperature stress and shorter process times while having the potential for high mechanical bond strengths and high hermetic properties. The laser parameter of power, marking speed and number of repetitions, which control the local temperature input by the laser, are evaluated. With optimum parameters a mechanical strength of at least 42.2 MPa is achieved, based on the bonding area of 4.6 mm(exp 2). Here, the glass substrate breaks and the bond is not the limiting factor for the mechanical strength. A problem for the hermeticity is cracking of the glass substrate caused by too high temperature input which is shown in detail in this paper. This requires a high control of the temperature input by an automatic laser power regulation or substrate cooling for further optimization potential.
AB - Hermetic packages fabricated using silicon microtechnology are important for the actual miniaturisation of quantum sensors, which will provide high accuracy and sensitivity for future industrial systems. For this purpose, bonding between silicon and glass with a UV marking laser is investigated. Compared to other hermetic bonding methods, laser bonding allows a lower global temperature stress and shorter process times while having the potential for high mechanical bond strengths and high hermetic properties. The laser parameter of power, marking speed and number of repetitions, which control the local temperature input by the laser, are evaluated. With optimum parameters a mechanical strength of at least 42.2 MPa is achieved, based on the bonding area of 4.6 mm(exp 2). Here, the glass substrate breaks and the bond is not the limiting factor for the mechanical strength. A problem for the hermeticity is cracking of the glass substrate caused by too high temperature input which is shown in detail in this paper. This requires a high control of the temperature input by an automatic laser power regulation or substrate cooling for further optimization potential.
KW - Packages
KW - Laserunterstütztes Bonding
KW - Silizium-Glas
KW - Packages
KW - Laser assisted bonding
KW - silicon-glass
UR - http://www.scopus.com/inward/record.url?scp=85196912245&partnerID=8YFLogxK
M3 - Conference contribution
SN - 978-3-8007-6203-3
SP - 332
EP - 335
BT - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
ER -