Details
| Original language | English |
|---|---|
| Title of host publication | 26th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2007 - Congress Proceedings |
| Place of Publication | Orlando, Fla. |
| Publisher | Laser Institute of America |
| Pages | 123-132 |
| ISBN (print) | 9780912035888 |
| Publication status | Published - 2007 |
| Externally published | Yes |
| Event | 26th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2007 - Orlando, FL, United States Duration: 29 Oct 2007 → 1 Nov 2007 |
Abstract
We investigate two laser processes for surface texturing of silicon solar cells. One uses direct laser ablation of Si of the as-cut wafers without any masking technique. The other process structures a dielectric layer that is subsequently used as an etching mask. Both texturing processes combine laser structuring and wet chemical etching. Besides a spot-wise scanning process using a solid state laser system that features a galvo scanner, also an imaging technique based on an excimer laser is applied. With both approaches we achieve a homogeneous, honeycomb-like texture on the silicon wafer surface. The approach with the excimer laser is economically more attractive due to a substantially higher throughput.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
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26th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2007 - Congress Proceedings. Orlando, Fla.: Laser Institute of America, 2007. p. 123-132 305.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Laser surface texturing for reducing reflection losses in multicristalline silicon solar cells
AU - Grischke, R.
AU - Terheiden, B.
AU - Mau, S.
AU - Harder, N. P.
AU - Schoonderbeek, A.
AU - Kling, R.
AU - Ostendorf, A.
AU - Denkena, B.
AU - Brendel, R.
PY - 2007
Y1 - 2007
N2 - We investigate two laser processes for surface texturing of silicon solar cells. One uses direct laser ablation of Si of the as-cut wafers without any masking technique. The other process structures a dielectric layer that is subsequently used as an etching mask. Both texturing processes combine laser structuring and wet chemical etching. Besides a spot-wise scanning process using a solid state laser system that features a galvo scanner, also an imaging technique based on an excimer laser is applied. With both approaches we achieve a homogeneous, honeycomb-like texture on the silicon wafer surface. The approach with the excimer laser is economically more attractive due to a substantially higher throughput.
AB - We investigate two laser processes for surface texturing of silicon solar cells. One uses direct laser ablation of Si of the as-cut wafers without any masking technique. The other process structures a dielectric layer that is subsequently used as an etching mask. Both texturing processes combine laser structuring and wet chemical etching. Besides a spot-wise scanning process using a solid state laser system that features a galvo scanner, also an imaging technique based on an excimer laser is applied. With both approaches we achieve a homogeneous, honeycomb-like texture on the silicon wafer surface. The approach with the excimer laser is economically more attractive due to a substantially higher throughput.
UR - http://www.scopus.com/inward/record.url?scp=85088737535&partnerID=8YFLogxK
U2 - 10.2351/1.5061062
DO - 10.2351/1.5061062
M3 - Conference contribution
AN - SCOPUS:85088737535
SN - 9780912035888
SP - 123
EP - 132
BT - 26th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2007 - Congress Proceedings
PB - Laser Institute of America
CY - Orlando, Fla.
T2 - 26th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2007
Y2 - 29 October 2007 through 1 November 2007
ER -