Details
| Original language | English |
|---|---|
| Title of host publication | 2021 IEEE Energy Conversion Congress and Exposition, ECCE 2021 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 2747-2754 |
| Number of pages | 8 |
| ISBN (electronic) | 9781728151359 |
| ISBN (print) | 978-1-7281-6128-0 |
| Publication status | Published - 2021 |
| Event | 13th IEEE Energy Conversion Congress and Exposition, ECCE 2021 - Virtual, Online, Canada Duration: 10 Oct 2021 → 14 Oct 2021 |
Publication series
| Name | 2021 IEEE Energy Conversion Congress and Exposition, ECCE 2021 - Proceedings |
|---|---|
| ISSN (Print) | 2329-3721 |
| ISSN (electronic) | 2329-3748 |
Abstract
Temperature-sensitive electrical parameters (TSEPs) can be used for on-line determination of the junction temperature of semiconductors and as key parameters for degradation detection. Typical TSEPs are on-state voltages and switching times. Measuring these TSEPs of fast switching SiC power modules with high switching frequencies is challenging in terms of circuit design. This work presents TSEP measurement hardware for SiC modules capable of measuring switching times and on-state voltages during PWM operation. The system is evaluated in double-pulse experiments as well as in regular inverter operation. Finally, the power module's thermal impedance system is artificially increased and the system's capability to detect this change is shown.
Keywords
- Hardware, Maintenance, Measurement, Reliability, SiC, Thermal Modeling, TSEP
ASJC Scopus subject areas
- Energy(all)
- Renewable Energy, Sustainability and the Environment
- Energy(all)
- Energy Engineering and Power Technology
- Engineering(all)
- Electrical and Electronic Engineering
Sustainable Development Goals
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2021 IEEE Energy Conversion Congress and Exposition, ECCE 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021. p. 2747-2754 (2021 IEEE Energy Conversion Congress and Exposition, ECCE 2021 - Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Junction Temperature Estimation of SiC MOSFETs during Inverter Operation Using Switching Times and On-State Voltages
AU - Herwig, Daniel
AU - Mertens, Axel
N1 - Funding Information: This work was funded by the German Federal Ministry of Education and Research under the funding code 16EMO0325. The authors are responsible for the content of this publication.
PY - 2021
Y1 - 2021
N2 - Temperature-sensitive electrical parameters (TSEPs) can be used for on-line determination of the junction temperature of semiconductors and as key parameters for degradation detection. Typical TSEPs are on-state voltages and switching times. Measuring these TSEPs of fast switching SiC power modules with high switching frequencies is challenging in terms of circuit design. This work presents TSEP measurement hardware for SiC modules capable of measuring switching times and on-state voltages during PWM operation. The system is evaluated in double-pulse experiments as well as in regular inverter operation. Finally, the power module's thermal impedance system is artificially increased and the system's capability to detect this change is shown.
AB - Temperature-sensitive electrical parameters (TSEPs) can be used for on-line determination of the junction temperature of semiconductors and as key parameters for degradation detection. Typical TSEPs are on-state voltages and switching times. Measuring these TSEPs of fast switching SiC power modules with high switching frequencies is challenging in terms of circuit design. This work presents TSEP measurement hardware for SiC modules capable of measuring switching times and on-state voltages during PWM operation. The system is evaluated in double-pulse experiments as well as in regular inverter operation. Finally, the power module's thermal impedance system is artificially increased and the system's capability to detect this change is shown.
KW - Hardware
KW - Maintenance
KW - Measurement
KW - Reliability
KW - SiC
KW - Thermal Modeling
KW - TSEP
UR - http://www.scopus.com/inward/record.url?scp=85123355875&partnerID=8YFLogxK
U2 - 10.1109/ECCE47101.2021.9595535
DO - 10.1109/ECCE47101.2021.9595535
M3 - Conference contribution
AN - SCOPUS:85123355875
SN - 978-1-7281-6128-0
T3 - 2021 IEEE Energy Conversion Congress and Exposition, ECCE 2021 - Proceedings
SP - 2747
EP - 2754
BT - 2021 IEEE Energy Conversion Congress and Exposition, ECCE 2021 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 13th IEEE Energy Conversion Congress and Exposition, ECCE 2021
Y2 - 10 October 2021 through 14 October 2021
ER -