Details
| Original language | English |
|---|---|
| Title of host publication | Tribology in Manufacturing Processes and Joining by Plastic Deformation |
| Pages | 453-460 |
| Number of pages | 8 |
| Publication status | Published - Jun 2014 |
| Event | 6th International Conference on Tribology in Manufacturing Processes and Joining by Plastic Deformation, ICTMP 2014 - Darmstadt, Germany Duration: 22 Jun 2014 → 24 Jun 2014 |
Publication series
| Name | Advanced Materials Research |
|---|---|
| Volume | 966-967 |
| ISSN (Print) | 1022-6680 |
| ISSN (electronic) | 1662-8985 |
Abstract
Cold pressure welding is a versatile process that can be used to weld most metals. It is, however, difficult to achieve a weld at room temperature through the application of pressure. As in every welding process, several different parameters have to be considered: the metals to be welded and their properties in terms of surface condition, cleanliness, strength of the metal, and so on. The surface condition and surface preparation methods are the most important parameters, since the cold weld is based solely on the contact between the two metal surfaces that are involved. Joining with electrochemical support (ECUF) is a new approach that overcomes most of the current process barriers and limitations through optimized electrochemical surface treatment and an improved process technology based on a pilger roll. This paper provides an overview of the ECUF process and current research results on the pressure welding of pure copper (CW004A). The formation of the weld has been investigated and the welding interface characterized in respect of its microstructure.
Keywords
- Cold pressure welding, Copper, Cyclic voltammetry, Surface activation
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
Cite this
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Tribology in Manufacturing Processes and Joining by Plastic Deformation. 2014. p. 453-460 (Advanced Materials Research; Vol. 966-967).
Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
}
TY - CHAP
T1 - Joining with electrochemical support: cold pressure welding of copper
T2 - 6th International Conference on Tribology in Manufacturing Processes and Joining by Plastic Deformation, ICTMP 2014
AU - Schmidt, Hans Christian
AU - Rodman, Dmytro
AU - Grydin, Olexandr
AU - Ebbert, Christoph
AU - Homberg, Werner
AU - Maier, Hans Jürgen
AU - Grundmeier, Guido
PY - 2014/6
Y1 - 2014/6
N2 - Cold pressure welding is a versatile process that can be used to weld most metals. It is, however, difficult to achieve a weld at room temperature through the application of pressure. As in every welding process, several different parameters have to be considered: the metals to be welded and their properties in terms of surface condition, cleanliness, strength of the metal, and so on. The surface condition and surface preparation methods are the most important parameters, since the cold weld is based solely on the contact between the two metal surfaces that are involved. Joining with electrochemical support (ECUF) is a new approach that overcomes most of the current process barriers and limitations through optimized electrochemical surface treatment and an improved process technology based on a pilger roll. This paper provides an overview of the ECUF process and current research results on the pressure welding of pure copper (CW004A). The formation of the weld has been investigated and the welding interface characterized in respect of its microstructure.
AB - Cold pressure welding is a versatile process that can be used to weld most metals. It is, however, difficult to achieve a weld at room temperature through the application of pressure. As in every welding process, several different parameters have to be considered: the metals to be welded and their properties in terms of surface condition, cleanliness, strength of the metal, and so on. The surface condition and surface preparation methods are the most important parameters, since the cold weld is based solely on the contact between the two metal surfaces that are involved. Joining with electrochemical support (ECUF) is a new approach that overcomes most of the current process barriers and limitations through optimized electrochemical surface treatment and an improved process technology based on a pilger roll. This paper provides an overview of the ECUF process and current research results on the pressure welding of pure copper (CW004A). The formation of the weld has been investigated and the welding interface characterized in respect of its microstructure.
KW - Cold pressure welding
KW - Copper
KW - Cyclic voltammetry
KW - Surface activation
UR - http://www.scopus.com/inward/record.url?scp=84903954179&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/amr.966-967.453
DO - 10.4028/www.scientific.net/amr.966-967.453
M3 - Contribution to book/anthology
AN - SCOPUS:84903954179
SN - 9783038351276
T3 - Advanced Materials Research
SP - 453
EP - 460
BT - Tribology in Manufacturing Processes and Joining by Plastic Deformation
Y2 - 22 June 2014 through 24 June 2014
ER -