Details
| Original language | English |
|---|---|
| Article number | 108718 |
| Journal | Materials and design |
| Volume | 192 |
| Publication status | Published - 5 Apr 2020 |
Abstract
Despite the wide and long-term applications of ultrasonic (US) wire bonding and other US metal joining technologies, the mechanism of microweld changes during the bonding process, including formation, deformation and breakage, is rarely known as it is very difficult to be investigated by experiments. In this work, this mechanism under different surface topographies and displacement patterns is studied by molecular dynamics simulation. It is found that microwelds can be formed or broken instantly. Due to the relative motion between the local wire part and the local substrate part, microwelds can be largely deformed or even broken. The impacts of material, surface topography, approaching distance and vibration amplitude on the microweld changes are investigated via the quantification of the shear stress and the equivalent bonded area. It is shown that these four factors significantly influence the final connection and the interface structure. The analysis of the scale influence on the microweld changes shows that the simulation results at a small-scale are able to represent those at a large-scale which is close to the range of the commonly used surface roughness. This deeper understanding on the microweld changes leads to a better control strategy and an enhancement of the bonding process.
Keywords
- Bonding mechanism, Microweld formation & breakage, Molecular dynamics simulation, Ultrasonic wire bonding
ASJC Scopus subject areas
- Materials Science(all)
- General Materials Science
- Engineering(all)
- Mechanics of Materials
- Engineering(all)
- Mechanical Engineering
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In: Materials and design, Vol. 192, 108718, 05.04.2020.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation
AU - Long, Yangyang
AU - He, Bo
AU - Cui, Weizhe
AU - Ji, Yuhang
AU - Zhuang, Xiaoying
AU - Twiefel, Jens
N1 - Funding information: The financial support from DFG ( Deutsche Forschungsgemeinschaft ) program ( TW75/8-1|WA564/40-1 ) is gratefully acknowledged. The publication of this article was funded by the Open Access Publishing Fund of Leibniz Universität Hannover .
PY - 2020/4/5
Y1 - 2020/4/5
N2 - Despite the wide and long-term applications of ultrasonic (US) wire bonding and other US metal joining technologies, the mechanism of microweld changes during the bonding process, including formation, deformation and breakage, is rarely known as it is very difficult to be investigated by experiments. In this work, this mechanism under different surface topographies and displacement patterns is studied by molecular dynamics simulation. It is found that microwelds can be formed or broken instantly. Due to the relative motion between the local wire part and the local substrate part, microwelds can be largely deformed or even broken. The impacts of material, surface topography, approaching distance and vibration amplitude on the microweld changes are investigated via the quantification of the shear stress and the equivalent bonded area. It is shown that these four factors significantly influence the final connection and the interface structure. The analysis of the scale influence on the microweld changes shows that the simulation results at a small-scale are able to represent those at a large-scale which is close to the range of the commonly used surface roughness. This deeper understanding on the microweld changes leads to a better control strategy and an enhancement of the bonding process.
AB - Despite the wide and long-term applications of ultrasonic (US) wire bonding and other US metal joining technologies, the mechanism of microweld changes during the bonding process, including formation, deformation and breakage, is rarely known as it is very difficult to be investigated by experiments. In this work, this mechanism under different surface topographies and displacement patterns is studied by molecular dynamics simulation. It is found that microwelds can be formed or broken instantly. Due to the relative motion between the local wire part and the local substrate part, microwelds can be largely deformed or even broken. The impacts of material, surface topography, approaching distance and vibration amplitude on the microweld changes are investigated via the quantification of the shear stress and the equivalent bonded area. It is shown that these four factors significantly influence the final connection and the interface structure. The analysis of the scale influence on the microweld changes shows that the simulation results at a small-scale are able to represent those at a large-scale which is close to the range of the commonly used surface roughness. This deeper understanding on the microweld changes leads to a better control strategy and an enhancement of the bonding process.
KW - Bonding mechanism
KW - Microweld formation & breakage
KW - Molecular dynamics simulation
KW - Ultrasonic wire bonding
UR - http://www.scopus.com/inward/record.url?scp=85083528841&partnerID=8YFLogxK
U2 - 10.1016/j.matdes.2020.108718
DO - 10.1016/j.matdes.2020.108718
M3 - Article
AN - SCOPUS:85083528841
VL - 192
JO - Materials and design
JF - Materials and design
SN - 0264-1275
M1 - 108718
ER -