Investigations on embedding nanoparticles by electroplating

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • M. Wurz
  • T. Oekermann
  • P. Wagner
  • C. Ruffert
  • J. Caro
  • H. H. Gatzen
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Details

Original languageEnglish
Title of host publicationECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting
Pages207-216
Number of pages10
Edition45
Publication statusPublished - 2009
EventMagnetic Materials, Processes and Devices 10 - 214th ECS Meeting - Honolulu, HI, United States
Duration: 12 Oct 200817 Oct 2008

Publication series

NameECS Transactions
Number45
Volume16
ISSN (Print)1938-5862
ISSN (electronic)1938-6737

Abstract

To create a surface suitable for tribological applications, a layer of nanoparticles was deposited on a metal coated substrate, followed by embedding the nanoparticles in a metal matrix. For the deposition, TiO2 and SiO2 nanoparticles were used, followed by a Cu embedding by electroplating. TiO2 particles failed to deliver satisfying results due to agglomeration. The results coming closest to achieving a monolayer were obtained with SiO2 nanoparticles. For the deposition, the SiO 2 nanoparticles were attracted to the surface by utilizing zeta potential differences between the surface and the nanoparticles. To achieve an optimal zeta potential, the pH value of the deposition solution was adjusted appropriately. After their deposition, the SiO2 nanoparticles were attached to the surface by heat treatment. Afterwards, the SiO2 nanoparticles were embedded by electroplating. Best electroplating results were achieved on SiO2 nanoparticle layers with no continuous surface coverage, i.e. occasional voids between the nanoparticles.

ASJC Scopus subject areas

Cite this

Investigations on embedding nanoparticles by electroplating. / Wurz, M.; Oekermann, T.; Wagner, P. et al.
ECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting. 45. ed. 2009. p. 207-216 (ECS Transactions; Vol. 16, No. 45).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Wurz, M, Oekermann, T, Wagner, P, Ruffert, C, Caro, J & Gatzen, HH 2009, Investigations on embedding nanoparticles by electroplating. in ECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting. 45 edn, ECS Transactions, no. 45, vol. 16, pp. 207-216, Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting, Honolulu, HI, United States, 12 Oct 2008. https://doi.org/10.1149/1.3140023
Wurz, M., Oekermann, T., Wagner, P., Ruffert, C., Caro, J., & Gatzen, H. H. (2009). Investigations on embedding nanoparticles by electroplating. In ECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting (45 ed., pp. 207-216). (ECS Transactions; Vol. 16, No. 45). https://doi.org/10.1149/1.3140023
Wurz M, Oekermann T, Wagner P, Ruffert C, Caro J, Gatzen HH. Investigations on embedding nanoparticles by electroplating. In ECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting. 45 ed. 2009. p. 207-216. (ECS Transactions; 45). doi: 10.1149/1.3140023
Wurz, M. ; Oekermann, T. ; Wagner, P. et al. / Investigations on embedding nanoparticles by electroplating. ECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting. 45. ed. 2009. pp. 207-216 (ECS Transactions; 45).
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