Investigation of a fine positioning method in lathes using an active clamping chuck

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • B. Denkena
  • L. Hülsemeyer
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Details

Original languageEnglish
Title of host publicationProceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015
EditorsR. Leach
Pages245-246
Number of pages2
ISBN (electronic)9780956679079
Publication statusPublished - 1 Jan 2015
Event15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015 - Leuven, Belgium
Duration: 1 Jun 20155 Jun 2015

Publication series

NameProceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015

Abstract

For an active compensation of workpiece clamping failures in lathes a novel fine positioning method using an active chuck is developed. The position of the workpiece is determined by two tactile displacement sensors. The chuck consists of integrated stepper motors which compensate eccentric displacement and tilting errors. The corrected position is fixed by frictional locking caused by the tensile force. All components required for this purpose are implemented in a lathe and examined in a turning process. The results proof a significant reduction of eccentric errors and the basic suitability of this method.

Keywords

    Clamping technology, Fine positioning, Lathe

ASJC Scopus subject areas

Cite this

Investigation of a fine positioning method in lathes using an active clamping chuck. / Denkena, B.; Hülsemeyer, L.
Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015. ed. / R. Leach. 2015. p. 245-246 (Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Denkena, B & Hülsemeyer, L 2015, Investigation of a fine positioning method in lathes using an active clamping chuck. in R Leach (ed.), Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015. Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015, pp. 245-246, 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015, Leuven, Belgium, 1 Jun 2015. <https://www.euspen.eu/resource/investigation-of-a-fine-positioning-method-in-lathes-using-an-active-clamping-chuck/>
Denkena, B., & Hülsemeyer, L. (2015). Investigation of a fine positioning method in lathes using an active clamping chuck. In R. Leach (Ed.), Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015 (pp. 245-246). (Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015). https://www.euspen.eu/resource/investigation-of-a-fine-positioning-method-in-lathes-using-an-active-clamping-chuck/
Denkena B, Hülsemeyer L. Investigation of a fine positioning method in lathes using an active clamping chuck. In Leach R, editor, Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015. 2015. p. 245-246. (Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015).
Denkena, B. ; Hülsemeyer, L. / Investigation of a fine positioning method in lathes using an active clamping chuck. Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015. editor / R. Leach. 2015. pp. 245-246 (Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015).
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