Details
| Original language | English |
|---|---|
| Article number | 8910511 |
| Pages (from-to) | 3243-3246 |
| Number of pages | 4 |
| Journal | IEEE J. Solid State Circuits |
| Volume | 54 |
| Issue number | 12 |
| Publication status | Published - 22 Nov 2019 |
| Event | 2019 IEEE International Solid- State Circuits Conference - (ISSCC) - San Fransisco, United States Duration: 17 Feb 2019 → 21 Feb 2019 |
Abstract
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
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In: IEEE J. Solid State Circuits, Vol. 54, No. 12, 8910511, 22.11.2019, p. 3243-3246.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Introduction to the Special Issue on the 2019 IEEE International Solid-State Circuits Conference (ISSCC)
AU - Chae, Youngcheol
AU - Wicht, Bernhard
AU - Verbruggen, Bob
AU - Heydari, Payam
AU - Luong, Howard
N1 - Funding information: Dr. Chae is a member of the Technical Program Committee of the International Solid-State Circuits Conference and the Asian Solid-State Circuits Conference. He was a recipient of the Best Young Professor Award in Engineering from Yonsei University in 2018, the Haedong Young Engineer Award from the IEE Korea in 2017, the Outstanding Research Awards of Yonsei University in 2017 and 2018, the Outstanding Teaching Awards of Yonsei University in 2013 and 2014, the Research Grant from the Samsung Research Funding Center in 2017, and the VENI Grant from the Dutch Technology Foundation STW in 2011. He is also a Distinguished Lecturer of the IEEE Solid-State Circuits Society. Payam Heydari (M’01–SM’09–F’17) received the Ph.D. degree from the University of Southern California, Los Angeles, CA, USA, in 2001. He is currently a Full Professor of electrical engineering with the University of California at Irvine (UC-Irvine), Irvine, CA, USA. His group created the world’s first fundamental frequency CMOS transceiver operating above 200 GHz. He is the (co)author of two books, two book chapters, and more than 150 journal and conference articles. His research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. Dr. Heydari was a member of the Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). He is a member of the Technical Program Committee of the IEEE Custom Integrated Circuits Conference (CICC). He was a recipient of the 2016–2017 UCI’s School of Engineering Mid-Career Excellence in Research, the 2014 Dis-tinguished Engineering Educator Award from the Orange County Engineering Council, the 2009 Business Plan Competition First Place Prize Award and the Best Concept Paper Award from the Paul Merage School of Business, UC-Irvine, the 2010 Faculty of the Year Award from the UC-Irvine’s Engineering Student Council (ECS), the 2009 School of Engineering Best Faculty Research Award, the 2007 IEEE Circuits and Systems Society Guillemin-Cauer Award, the 2005 IEEE Circuits and Systems Society Darlington Award, and the 2005 National Science Foundation (NSF) CAREER Award. He serves on the AdCom of the IEEE Solid-State Circuits Society. He was an Associate Editor of the IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS—PART I. He serves as an Associate Editor and a Guest Editor for the IEEE JOURNAL OF SOLID-STATE CIRCUITS and an Associate Editor for the IEEE SOLID-STATE CIRCUITS LETTERS. He was a Distinguished Lecturer of the IEEE Solid-State Circuits Society from January 2014 to January 2016. He is also a Distinguished Microwave Lecturer of the IEEE Microwave Theory and Techniques Society for the period of January 2019 to December 2022.
PY - 2019/11/22
Y1 - 2019/11/22
N2 - This special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2019 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 17–21, 2019, in San Francisco, CA, USA. This issue covers articles from the Analog, Power Management, Data Converters, RF, and Wireless Committees
AB - This special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2019 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 17–21, 2019, in San Francisco, CA, USA. This issue covers articles from the Analog, Power Management, Data Converters, RF, and Wireless Committees
UR - http://www.scopus.com/inward/record.url?scp=85075611847&partnerID=8YFLogxK
U2 - 10.1109/JSSC.2019.2946496
DO - 10.1109/JSSC.2019.2946496
M3 - Article
VL - 54
SP - 3243
EP - 3246
JO - IEEE J. Solid State Circuits
JF - IEEE J. Solid State Circuits
SN - 1558-173X
IS - 12
M1 - 8910511
T2 - 2019 IEEE International Solid- State Circuits Conference - (ISSCC)
Y2 - 17 February 2019 through 21 February 2019
ER -