Details
Original language | English |
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Title of host publication | 2013 IEEE International Symposium on Circuits and Systems, ISCAS 2013 |
Subtitle of host publication | ISCAS 2013 |
Pages | 1636-1639 |
Number of pages | 4 |
Publication status | Published - Aug 2013 |
Event | 2013 IEEE International Symposium on Circuits and Systems, ISCAS 2013 - Beijing, China Duration: 19 May 2013 → 23 May 2013 |
Publication series
Name | Proceedings - IEEE International Symposium on Circuits and Systems |
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ISSN (Print) | 0271-4310 |
Abstract
In this paper, two inter-layer intra mode coding tools are proposed for the all intra spatial scalable extension of High Efficiency Video Coding (HEVC). The proposed methods make use of the correlations between intra prediction mode information in base layer and enhancement layer to improve the intra mode coding in enhancement layer. The first approach directly utilizes the intra prediction mode from the corresponding prediction unit (PU) in base layer as the intra prediction mode of the enhancement layer PU, while the second approach uses the intra prediction mode of the corresponding base layer PU as an additional most probable mode candidate. Dyadic all intra spatial scalability with 2 layers is tested in our experiments. Compared to enhancement layer only, the experimental results show a maximal 1.2% luma BD-rate reduction for the test sequences relative to inter-layer intra prediction.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
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2013 IEEE International Symposium on Circuits and Systems, ISCAS 2013: ISCAS 2013. 2013. p. 1636-1639 6572176 (Proceedings - IEEE International Symposium on Circuits and Systems).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Inter-layer Intra Mode Coding for the Scalable Extension of HEVC
AU - Zhao, Zhijie
AU - Si, Junyong
AU - Ostermann, Joern
AU - Li, Weiping
PY - 2013/8
Y1 - 2013/8
N2 - In this paper, two inter-layer intra mode coding tools are proposed for the all intra spatial scalable extension of High Efficiency Video Coding (HEVC). The proposed methods make use of the correlations between intra prediction mode information in base layer and enhancement layer to improve the intra mode coding in enhancement layer. The first approach directly utilizes the intra prediction mode from the corresponding prediction unit (PU) in base layer as the intra prediction mode of the enhancement layer PU, while the second approach uses the intra prediction mode of the corresponding base layer PU as an additional most probable mode candidate. Dyadic all intra spatial scalability with 2 layers is tested in our experiments. Compared to enhancement layer only, the experimental results show a maximal 1.2% luma BD-rate reduction for the test sequences relative to inter-layer intra prediction.
AB - In this paper, two inter-layer intra mode coding tools are proposed for the all intra spatial scalable extension of High Efficiency Video Coding (HEVC). The proposed methods make use of the correlations between intra prediction mode information in base layer and enhancement layer to improve the intra mode coding in enhancement layer. The first approach directly utilizes the intra prediction mode from the corresponding prediction unit (PU) in base layer as the intra prediction mode of the enhancement layer PU, while the second approach uses the intra prediction mode of the corresponding base layer PU as an additional most probable mode candidate. Dyadic all intra spatial scalability with 2 layers is tested in our experiments. Compared to enhancement layer only, the experimental results show a maximal 1.2% luma BD-rate reduction for the test sequences relative to inter-layer intra prediction.
UR - http://www.scopus.com/inward/record.url?scp=84883360992&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2013.6572176
DO - 10.1109/ISCAS.2013.6572176
M3 - Conference contribution
AN - SCOPUS:84883360992
SN - 9781467357609
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 1636
EP - 1639
BT - 2013 IEEE International Symposium on Circuits and Systems, ISCAS 2013
T2 - 2013 IEEE International Symposium on Circuits and Systems, ISCAS 2013
Y2 - 19 May 2013 through 23 May 2013
ER -