Details
| Original language | English |
|---|---|
| Title of host publication | Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019 |
| Publisher | OSA - The Optical Society |
| ISBN (electronic) | 9781557528209 |
| ISBN (print) | 9781943580644 |
| Publication status | Published - 2019 |
| Externally published | Yes |
| Event | Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019 - Burlingame, United States Duration: 29 Jul 2019 → 1 Aug 2019 |
Publication series
| Name | Optics InfoBase Conference Papers |
|---|---|
| Volume | Part F131-IPRSN 2019 |
Abstract
The heterogeneous integration of AlGaAs-on-insulator has great potential for nonlinear optics. This talk will explore chip-scale bonding and transfer printing techniques for the development of integrated photonic chips for second- and third-order non-linear applications.
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Mechanics of Materials
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Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019. OSA - The Optical Society, 2019. (Optics InfoBase Conference Papers; Vol. Part F131-IPRSN 2019).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Integrated AlGaAs devices for non-linear applications
AU - May, Stuart
AU - McPhillimy, J.
AU - Klitis, C.
AU - Guilhabert, B.
AU - Kues, Michael
AU - Dawson, M. D.
AU - Strain, M. J.
AU - Clerici, Matteo
AU - Sorel, Marc
N1 - Publisher Copyright: © 2019 The Author(s). Copyright: Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2019
Y1 - 2019
N2 - The heterogeneous integration of AlGaAs-on-insulator has great potential for nonlinear optics. This talk will explore chip-scale bonding and transfer printing techniques for the development of integrated photonic chips for second- and third-order non-linear applications.
AB - The heterogeneous integration of AlGaAs-on-insulator has great potential for nonlinear optics. This talk will explore chip-scale bonding and transfer printing techniques for the development of integrated photonic chips for second- and third-order non-linear applications.
UR - http://www.scopus.com/inward/record.url?scp=85077199587&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85077199587
SN - 9781943580644
T3 - Optics InfoBase Conference Papers
BT - Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019
PB - OSA - The Optical Society
T2 - Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019
Y2 - 29 July 2019 through 1 August 2019
ER -