Details
| Original language | English |
|---|---|
| Publication status | Published - 2007 |
| Externally published | Yes |
| Event | Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007 - Paris, France Duration: 27 Mar 2007 → 28 Mar 2007 |
Conference
| Conference | Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007 |
|---|---|
| Country/Territory | France |
| City | Paris |
| Period | 27 Mar 2007 → 28 Mar 2007 |
ASJC Scopus subject areas
- Computer Science(all)
- Artificial Intelligence
- Computer Science(all)
- Computer Networks and Communications
- Computer Science(all)
- Computer Science Applications
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2007. Paper presented at Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007, Paris, France.
Research output: Contribution to conference › Paper › Research › peer review
}
TY - CONF
T1 - Influences on the automated assembly of hybrid microsystems with high accuracy
AU - Hesselbach, Jürgen
AU - Raatz, Annika
AU - Schöttler, Kerstin
N1 - Funding information: [1] EN ISO 9283: Industrieroboter, Leistungskenngrößen und zugehörige Prüfmethoden. Beuth-Verlag, Berlin, 1999 [2] Tutsch, R.; Petz, M.; Berndt, M.; Hesselbach, J.; Pokar, G.; Heuer, K.: 3D-Sensor for the Control of a Micro Assembly Robot. Optomechatronic Systems IV, Proc. of SPIE, Vol. 5264, S. 267-273, Providence, USA, 2003 The authors gratefully acknowledge the funding of the reported work by the German Research Center (Collaborative Research Center 516 “Design and Manufacturing of Active Micro Systems“).
PY - 2007
Y1 - 2007
UR - http://www.scopus.com/inward/record.url?scp=85064621622&partnerID=8YFLogxK
U2 - 10.15488/13312
DO - 10.15488/13312
M3 - Paper
T2 - Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007
Y2 - 27 March 2007 through 28 March 2007
ER -