Influence of the technology on the destruction effects of semiconducters by impact of EMP and UWB pulses

Research output: Contribution to journalConference articleResearchpeer review

Authors

  • Michael Camp
  • Heyno Garbe
  • Daniel Nitsch
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Details

Original languageEnglish
Pages (from-to)87-92
Number of pages6
JournalIEEE International Symposium on Electromagnetic Compatibility
Volume1
Publication statusPublished - 2002
Event2002 IEEE International Symposium on Electromagnetic Compatibility - Minneapolis, MN, United States
Duration: 19 Aug 200223 Aug 2002

Abstract

The influence of the technology on the destruction effects of semiconductors by impact of EMP and UWB pulses was presented. The susceptibility of electronic devices to a transient electromagnetic field threat was measured. It was found that the CMOS devices first got reversible breakdowns and at much higher field amplitudes non reversible destructions occurred. The breakdown- (BT) and destruction thresholds (DT) were found to decrease much by extending the ribbon cable length or usage of pulses with faster rise times.

Keywords

    CMOS, EMP, Semiconductor, Susceptibility, TTL, UWB

ASJC Scopus subject areas

Cite this

Influence of the technology on the destruction effects of semiconducters by impact of EMP and UWB pulses. / Camp, Michael; Garbe, Heyno; Nitsch, Daniel.
In: IEEE International Symposium on Electromagnetic Compatibility, Vol. 1, 2002, p. 87-92.

Research output: Contribution to journalConference articleResearchpeer review

Camp, M, Garbe, H & Nitsch, D 2002, 'Influence of the technology on the destruction effects of semiconducters by impact of EMP and UWB pulses', IEEE International Symposium on Electromagnetic Compatibility, vol. 1, pp. 87-92.
Camp, M., Garbe, H., & Nitsch, D. (2002). Influence of the technology on the destruction effects of semiconducters by impact of EMP and UWB pulses. IEEE International Symposium on Electromagnetic Compatibility, 1, 87-92.
Camp M, Garbe H, Nitsch D. Influence of the technology on the destruction effects of semiconducters by impact of EMP and UWB pulses. IEEE International Symposium on Electromagnetic Compatibility. 2002;1:87-92.
Camp, Michael ; Garbe, Heyno ; Nitsch, Daniel. / Influence of the technology on the destruction effects of semiconducters by impact of EMP and UWB pulses. In: IEEE International Symposium on Electromagnetic Compatibility. 2002 ; Vol. 1. pp. 87-92.
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@article{4ca80924dbcc416b9ff491aba17a86b7,
title = "Influence of the technology on the destruction effects of semiconducters by impact of EMP and UWB pulses",
abstract = "The influence of the technology on the destruction effects of semiconductors by impact of EMP and UWB pulses was presented. The susceptibility of electronic devices to a transient electromagnetic field threat was measured. It was found that the CMOS devices first got reversible breakdowns and at much higher field amplitudes non reversible destructions occurred. The breakdown- (BT) and destruction thresholds (DT) were found to decrease much by extending the ribbon cable length or usage of pulses with faster rise times.",
keywords = "CMOS, EMP, Semiconductor, Susceptibility, TTL, UWB",
author = "Michael Camp and Heyno Garbe and Daniel Nitsch",
year = "2002",
language = "English",
volume = "1",
pages = "87--92",
note = "2002 IEEE International Symposium on Electromagnetic Compatibility ; Conference date: 19-08-2002 Through 23-08-2002",

}

Download

TY - JOUR

T1 - Influence of the technology on the destruction effects of semiconducters by impact of EMP and UWB pulses

AU - Camp, Michael

AU - Garbe, Heyno

AU - Nitsch, Daniel

PY - 2002

Y1 - 2002

N2 - The influence of the technology on the destruction effects of semiconductors by impact of EMP and UWB pulses was presented. The susceptibility of electronic devices to a transient electromagnetic field threat was measured. It was found that the CMOS devices first got reversible breakdowns and at much higher field amplitudes non reversible destructions occurred. The breakdown- (BT) and destruction thresholds (DT) were found to decrease much by extending the ribbon cable length or usage of pulses with faster rise times.

AB - The influence of the technology on the destruction effects of semiconductors by impact of EMP and UWB pulses was presented. The susceptibility of electronic devices to a transient electromagnetic field threat was measured. It was found that the CMOS devices first got reversible breakdowns and at much higher field amplitudes non reversible destructions occurred. The breakdown- (BT) and destruction thresholds (DT) were found to decrease much by extending the ribbon cable length or usage of pulses with faster rise times.

KW - CMOS

KW - EMP

KW - Semiconductor

KW - Susceptibility

KW - TTL

KW - UWB

UR - http://www.scopus.com/inward/record.url?scp=0036385024&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0036385024

VL - 1

SP - 87

EP - 92

JO - IEEE International Symposium on Electromagnetic Compatibility

JF - IEEE International Symposium on Electromagnetic Compatibility

SN - 0190-1494

T2 - 2002 IEEE International Symposium on Electromagnetic Compatibility

Y2 - 19 August 2002 through 23 August 2002

ER -